AMD Xilinx
XCV300E-7BGG432C
XCV300E-7BGG432C ECAD Model
XCV300E-7BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV300E-7BGG432C Datasheet Download
XCV300E-7BGG432C Overview
The chip model XCV300E-7BGG432C has been gaining attention from industries due to its advanced features and capabilities. It is a high-performance, low-power, and cost-effective chip model that is suitable for a wide range of applications. It is a multi-core processor with an integrated memory controller, memory protection unit, and other features that make it suitable for a variety of tasks.
The XCV300E-7BGG432C chip model is expected to be in high demand in the near future due to its advanced features and capabilities. It is expected to be used in a variety of applications, including networking, intelligent systems, and other applications that require high performance, low power consumption, and cost-efficiency.
The chip model is expected to be used in the era of fully intelligent systems. It is expected to be used in networks to enable intelligent scenarios, such as machine learning, artificial intelligence, and autonomous systems. It is also expected to be used in the development of new technologies, such as 5G and 6G networks, Internet of Things (IoT) devices, and autonomous vehicles.
The XCV300E-7BGG432C chip model is expected to be used in many applications in the near future. Its advanced features and capabilities make it suitable for a wide range of applications, including networking, intelligent systems, and other applications that require high performance, low power consumption, and cost-efficiency. It is expected to be used in the era of fully intelligent systems and to enable intelligent scenarios, such as machine learning, artificial intelligence, and autonomous systems. It is also expected to be used in the development of new technologies, such as 5G and 6G networks, Internet of Things (IoT) devices, and autonomous vehicles. The XCV300E-7BGG432C chip model is expected to be in high demand in the near future due to its advanced features and capabilities, and it is expected to be used in a variety of applications.
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