
AMD Xilinx
XCV300E-7BGG352I
XCV300E-7BGG352I ECAD Model
XCV300E-7BGG352I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 260 | |
Number of Outputs | 260 | |
Number of Logic Cells | 6912 | |
Number of Equivalent Gates | 82944 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 420 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 82944 GATES | |
Clock Frequency-Max | 400 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA352,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-352 | |
Pin Count | 352 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XCV300E-7BGG352I Datasheet Download
XCV300E-7BGG352I Overview
The XCV300E-7BGG352I chip model is a high-performance programmable logic device designed for digital signal processing, embedded processing, and image processing. It is a powerful tool for developers to create complex digital designs, and it requires the use of HDL language.
The XCV300E-7BGG352I chip model has a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to provide a high-speed, low-power solution for these applications. It also has a wide range of features, such as a high-speed logic fabric, high-speed transceivers, and embedded memory blocks.
The product description of the XCV300E-7BGG352I chip model includes the features, specifications, and other technical details. The design requirements include the power consumption, clock speed, and other parameters. It is important to note that the chip model should be used in accordance with the manufacturer's instructions.
In addition, there are several case studies available that illustrate the effectiveness of the XCV300E-7BGG352I chip model. These case studies demonstrate the performance of the chip model in various applications, such as digital signal processing, embedded processing, and image processing.
As for the application of the XCV300E-7BGG352I chip model in the development and popularization of future intelligent robots, it is possible. The chip model is capable of performing complex tasks, such as image processing and digital signal processing, which are essential for the development of intelligent robots. However, it is important to note that the chip model requires technical expertise in order to be used effectively. It is recommended that developers have a strong background in HDL language and other related technologies.
Overall, the XCV300E-7BGG352I chip model is a powerful and versatile tool for developers. It has a wide range of applications, and it is capable of performing complex tasks. It is important to note that the chip model requires technical expertise in order to be used effectively. Additionally, there are several case studies available that illustrate the effectiveness of the chip model. With the right technical expertise, the XCV300E-7BGG352I chip model can be used for the development and popularization of future intelligent robots.
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