XCV300E-7BGG352I
XCV300E-7BGG352I
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rohs

AMD Xilinx

XCV300E-7BGG352I


XCV300E-7BGG352I
F20-XCV300E-7BGG352I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-352
BGA-352

XCV300E-7BGG352I ECAD Model


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XCV300E-7BGG352I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 260
Number of Outputs 260
Number of Logic Cells 6912
Number of Equivalent Gates 82944
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 82944 GATES
Clock Frequency-Max 400 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-352
Pin Count 352
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01

XCV300E-7BGG352I Datasheet Download


XCV300E-7BGG352I Overview



The XCV300E-7BGG352I chip model is a high-performance programmable logic device designed for digital signal processing, embedded processing, and image processing. It is a powerful tool for developers to create complex digital designs, and it requires the use of HDL language.


The XCV300E-7BGG352I chip model has a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to provide a high-speed, low-power solution for these applications. It also has a wide range of features, such as a high-speed logic fabric, high-speed transceivers, and embedded memory blocks.


The product description of the XCV300E-7BGG352I chip model includes the features, specifications, and other technical details. The design requirements include the power consumption, clock speed, and other parameters. It is important to note that the chip model should be used in accordance with the manufacturer's instructions.


In addition, there are several case studies available that illustrate the effectiveness of the XCV300E-7BGG352I chip model. These case studies demonstrate the performance of the chip model in various applications, such as digital signal processing, embedded processing, and image processing.


As for the application of the XCV300E-7BGG352I chip model in the development and popularization of future intelligent robots, it is possible. The chip model is capable of performing complex tasks, such as image processing and digital signal processing, which are essential for the development of intelligent robots. However, it is important to note that the chip model requires technical expertise in order to be used effectively. It is recommended that developers have a strong background in HDL language and other related technologies.


Overall, the XCV300E-7BGG352I chip model is a powerful and versatile tool for developers. It has a wide range of applications, and it is capable of performing complex tasks. It is important to note that the chip model requires technical expertise in order to be used effectively. Additionally, there are several case studies available that illustrate the effectiveness of the chip model. With the right technical expertise, the XCV300E-7BGG352I chip model can be used for the development and popularization of future intelligent robots.



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