AMD Xilinx
XCV300E-6PQG240I
XCV300E-6PQG240I ECAD Model
XCV300E-6PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV300E-6PQG240I Datasheet Download
XCV300E-6PQG240I Overview
The chip model XCV300E-6PQG240I is a high-performance, low-power FPGA chip developed by Xilinx, a leading provider of programmable logic solutions. It is designed to meet the demands of next-generation data centers and networks, providing customers with the flexibility and scalability they need to meet the ever-changing needs of their businesses.
The XCV300E-6PQG240I is a highly integrated chip, offering a range of features including high-speed transceivers, advanced memory controllers, and a wide range of configurable logic blocks. It also offers a wide range of I/O options, allowing customers to customize the design to meet their specific needs. The chip is designed to be both power-efficient and cost-effective, making it an ideal choice for applications in a variety of industries.
When it comes to industry trends, the XCV300E-6PQG240I is well-suited for the current trend of increased demand for faster, more reliable networks and data centers. With its high-speed transceivers and memory controllers, the chip is capable of handling high-bandwidth data at low power consumption. Additionally, the chip's configurable logic blocks can be used to develop custom solutions for a variety of applications, making it an ideal choice for applications in the fields of artificial intelligence and machine learning.
In terms of future development, the XCV300E-6PQG240I is well-suited to the coming era of fully intelligent systems. The chip's configurable logic blocks can be used to develop custom solutions for a variety of applications, making it an ideal choice for applications in the fields of artificial intelligence and machine learning. Additionally, the chip's advanced memory controllers and wide range of I/O options make it well-suited for applications in the field of network and communication systems.
The original design intention of the XCV300E-6PQG240I was to provide customers with a cost-effective, power-efficient solution for their applications. The chip is designed to be highly flexible and scalable, allowing customers to customize their designs to meet their specific needs. Additionally, the chip is designed to be upgradeable, allowing customers to take advantage of new technologies as they become available.
In conclusion, the XCV300E-6PQG240I is a highly versatile and powerful FPGA chip that is well-suited for a variety of applications. Its high-speed transceivers, advanced memory controllers, and wide range of I/O options make it an ideal choice for applications in the fields of artificial intelligence, machine learning, and network and communication systems. Additionally, the chip is designed to be both cost-effective and power-efficient, making it a great choice for customers looking for a reliable solution for their applications.
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