
AMD Xilinx
XCV300E-6PQG240C
XCV300E-6PQG240C ECAD Model
XCV300E-6PQG240C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 158 | |
Number of Outputs | 158 | |
Number of Logic Cells | 6912 | |
Number of Equivalent Gates | 82944 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 82944 GATES | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | QFP240,1.3SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | PLASTIC, QFP-240 | |
Pin Count | 240 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XCV300E-6PQG240C Datasheet Download
XCV300E-6PQG240C Overview
The XCV300E-6PQG240C chip model is a powerful and versatile tool for modern technology. It is highly sought after in the industry, as it offers a multitude of features that make it an ideal choice for a variety of applications.
The XCV300E-6PQG240C chip model was designed to provide users with the best possible performance, while also being cost-effective. The chip model is capable of performing a wide range of tasks, from basic data processing to more complex operations such as AI and machine learning. It is also highly energy-efficient, making it a great choice for applications that require a lot of power.
The XCV300E-6PQG240C chip model is expected to be in high demand in the future, as it can be used in a variety of applications, from consumer electronics to industrial automation. The chip model has already been used in a variety of scenarios, such as in the automotive industry, where it is used to control various components, as well as in medical devices and even in smart home devices.
The XCV300E-6PQG240C chip model is highly upgradable, and can be used in a variety of advanced communication systems. It is capable of supporting both wired and wireless networks, and can be used in a variety of scenarios, such as in data centers, cloud computing, and even in the Internet of Things (IoT). The chip model is also capable of supporting the latest 5G networks, making it a great choice for applications that require high-speed data transmission.
The XCV300E-6PQG240C chip model is also capable of being used in intelligent scenarios, such as in autonomous vehicles and robots. It can be used to control the various components in these systems, as well as to process the data that is collected. The chip model is also capable of being used in the era of fully intelligent systems, as it is capable of processing large amounts of data quickly and accurately.
Overall, the XCV300E-6PQG240C chip model is a highly versatile tool that can be used in a variety of applications. It is highly upgradable and can be used in a variety of advanced communication systems. It is also capable of being used in intelligent scenarios, such as in autonomous vehicles and robots, and can be used in the era of fully intelligent systems. The chip model is expected to be in high demand in the future, as it offers users a multitude of features that make it an ideal choice for a variety of applications.
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