XCV300E-6PQG240C
XCV300E-6PQG240C
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rohs

AMD Xilinx

XCV300E-6PQG240C


XCV300E-6PQG240C
F20-XCV300E-6PQG240C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, QFP-240
PLASTIC, QFP-240

XCV300E-6PQG240C ECAD Model


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XCV300E-6PQG240C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 158
Number of Outputs 158
Number of Logic Cells 6912
Number of Equivalent Gates 82944
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 82944 GATES
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PQFP-G240
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 240
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Equivalence Code QFP240,1.3SQ,20
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 32 mm
Length 32 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description PLASTIC, QFP-240
Pin Count 240
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01

XCV300E-6PQG240C Datasheet Download


XCV300E-6PQG240C Overview



The XCV300E-6PQG240C chip model is a powerful and versatile tool for modern technology. It is highly sought after in the industry, as it offers a multitude of features that make it an ideal choice for a variety of applications.


The XCV300E-6PQG240C chip model was designed to provide users with the best possible performance, while also being cost-effective. The chip model is capable of performing a wide range of tasks, from basic data processing to more complex operations such as AI and machine learning. It is also highly energy-efficient, making it a great choice for applications that require a lot of power.


The XCV300E-6PQG240C chip model is expected to be in high demand in the future, as it can be used in a variety of applications, from consumer electronics to industrial automation. The chip model has already been used in a variety of scenarios, such as in the automotive industry, where it is used to control various components, as well as in medical devices and even in smart home devices.


The XCV300E-6PQG240C chip model is highly upgradable, and can be used in a variety of advanced communication systems. It is capable of supporting both wired and wireless networks, and can be used in a variety of scenarios, such as in data centers, cloud computing, and even in the Internet of Things (IoT). The chip model is also capable of supporting the latest 5G networks, making it a great choice for applications that require high-speed data transmission.


The XCV300E-6PQG240C chip model is also capable of being used in intelligent scenarios, such as in autonomous vehicles and robots. It can be used to control the various components in these systems, as well as to process the data that is collected. The chip model is also capable of being used in the era of fully intelligent systems, as it is capable of processing large amounts of data quickly and accurately.


Overall, the XCV300E-6PQG240C chip model is a highly versatile tool that can be used in a variety of applications. It is highly upgradable and can be used in a variety of advanced communication systems. It is also capable of being used in intelligent scenarios, such as in autonomous vehicles and robots, and can be used in the era of fully intelligent systems. The chip model is expected to be in high demand in the future, as it offers users a multitude of features that make it an ideal choice for a variety of applications.



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