AMD Xilinx
XCV300E-6FGG456I
XCV300E-6FGG456I ECAD Model
XCV300E-6FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 312 | |
| Number of Outputs | 312 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV300E-6FGG456I Datasheet Download
XCV300E-6FGG456I Overview
The XCV300E-6FGG456I chip model is a high-performance, flexible and reliable model that has been developed to meet the needs of a variety of applications. It is suitable for digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The original design intention of the chip model was to provide a powerful and flexible platform for various applications that require high-performance processing capabilities.
The XCV300E-6FGG456I chip model is designed to be upgradable and can be adapted to meet the needs of advanced communication systems. This model is also suitable for the development and popularization of future intelligent robots. It is highly reliable and efficient, and is capable of processing large amounts of data quickly and accurately. To use the model effectively, technical talents such as software engineers, hardware engineers and system engineers are needed.
The XCV300E-6FGG456I chip model is an excellent choice for a variety of applications due to its high-performance, flexibility and reliability. It is suitable for digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. Its original design intention was to provide a powerful and flexible platform for various applications that require high-performance processing capabilities. It is also capable of being upgraded to meet the needs of advanced communication systems, and is suitable for the development and popularization of future intelligent robots. To use the model effectively, technical talents such as software engineers, hardware engineers and system engineers are needed.
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5,406 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $66.9600 | $66.9600 |
| 10+ | $66.2400 | $662.4000 |
| 100+ | $62.6400 | $6,264.0000 |
| 1000+ | $59.0400 | $29,520.0000 |
| 10000+ | $54.0000 | $54,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||