XCV300E-6FGG456C
XCV300E-6FGG456C
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rohs

AMD Xilinx

XCV300E-6FGG456C


XCV300E-6FGG456C
F20-XCV300E-6FGG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-456
FBGA-456

XCV300E-6FGG456C ECAD Model


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XCV300E-6FGG456C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 312
Number of Outputs 312
Number of Logic Cells 6912
Number of Equivalent Gates 82944
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 82944 GATES
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-456
Pin Count 456
Reach Compliance Code unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XCV300E-6FGG456C Datasheet Download


XCV300E-6FGG456C Overview



The XCV300E-6FGG456C chip model is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is a powerful and flexible chip model that can be used in a variety of applications. It is equipped with a range of features, including a high-speed processor, a rich set of peripherals, and a wide range of memory and storage options.


The chip model XCV300E-6FGG456C is designed to be used with the HDL language. It is built with a wide range of features that make it suitable for a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more. The XCV300E-6FGG456C chip model is designed to be easy to use and configure, allowing the user to quickly and easily create their own applications.


When using the XCV300E-6FGG456C chip model, it is important to understand the product description and specific design requirements. This includes understanding the features of the chip model, and the types of applications it is best suited for. Additionally, it is important to understand the precautions and best practices when working with the chip model. This includes proper handling and storage, as well as understanding the safety requirements of the chip model.


When it comes to the development and popularization of future intelligent robots, the XCV300E-6FGG456C chip model can be a great asset. This chip model is designed to be used with the HDL language, making it ideal for the development of robots that require a high level of processing power and flexibility. Additionally, this chip model can be used to create a wide range of applications that are suitable for robots, such as image processing and navigation.


In order to use the XCV300E-6FGG456C chip model effectively, it is important to have a good understanding of HDL language, as well as the features and capabilities of the chip model. Additionally, it is important to have a good understanding of robotics and the types of applications that are suitable for robots. Having a good understanding of these topics will make it easier to use the chip model effectively and create the best applications for robots.



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QTY Unit Price Ext Price
1+ $66.9600 $66.9600
10+ $66.2400 $662.4000
100+ $62.6400 $6,264.0000
1000+ $59.0400 $29,520.0000
10000+ $54.0000 $54,000.0000
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