XCV300E-6FG456I
XCV300E-6FG456I
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AMD Xilinx

XCV300E-6FG456I


XCV300E-6FG456I
F20-XCV300E-6FG456I
Active
IC FPGA 312 I/O 456FBGA
456-FBGA (23x23)

XCV300E-6FG456I ECAD Model


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XCV300E-6FG456I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 131072
Number of I/O 312
Number of Gates 411955
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)
Base Product Number XCV300E

XCV300E-6FG456I Datasheet Download


XCV300E-6FG456I Overview



The XCV300E-6FG456I is a high-performance field programmable gate array (FPGA) chip manufactured by Xilinx. It is designed to provide a cost-effective solution for a wide range of applications, including embedded systems, digital signal processing (DSP) and high-speed data acquisition.


The XCV300E-6FG456I has a capacity of up to 300K logic cells, 6.5Mb of embedded RAM and is capable of operating at up to 300MHz. It also features a range of IO options, including LVDS, PCI Express, and Gigabit Ethernet. The chip is packaged in a 676-ball BGA package, making it suitable for a wide range of applications.


The XCV300E-6FG456I is a versatile chip, and can be used for a variety of applications. It can be used for embedded systems, DSP and data acquisition, as well as for high-speed networking and storage applications. It is also suitable for use in industrial automation and robotics, as well as for medical imaging and military applications.


Overall, the XCV300E-6FG456I is a powerful and cost-effective FPGA chip, suitable for a wide range of applications. It offers high performance, a range of IO options, and a versatile package that makes it suitable for a variety of applications.



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QTY Unit Price Ext Price
1+ $564.3217 $564.3217
10+ $558.2537 $5,582.5370
100+ $527.9138 $52,791.3825
1000+ $497.5740 $248,786.9750
10000+ $455.0981 $455,098.1250
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