
AMD Xilinx
XCV300E-6BGG432I
XCV300E-6BGG432I ECAD Model
XCV300E-6BGG432I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 316 | |
Number of Outputs | 316 | |
Number of Logic Cells | 6912 | |
Number of Equivalent Gates | 82944 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 82944 GATES | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B432 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 432 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA432,31X31,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-432 | |
Pin Count | 432 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XCV300E-6BGG432I Datasheet Download
XCV300E-6BGG432I Overview
The chip model XCV300E-6BGG432I has become a popular choice for many industries due to its high performance and low power consumption. This chip model is a 6-bit processor with a 32-bit instruction set, and it is designed to be compatible with a wide range of applications. It is a versatile chip model that is capable of performing a variety of tasks, including data processing, communications, and multimedia tasks.
The industry trends of the chip model XCV300E-6BGG432I are constantly changing, and the future development of related industries will depend on what specific technologies are needed. As new technologies emerge, the chip model must be able to support them in order to remain a viable option for many applications. In addition, the chip model must also be able to provide the necessary performance and power consumption to meet the requirements of the application environment.
When it comes to the application of the chip model XCV300E-6BGG432I, actual case studies are a great way to get a better understanding of the model's capabilities and limitations. Through these case studies, one can gain an understanding of how the chip model works in different scenarios and how it can be used to achieve the desired results. Additionally, there are certain precautions that should be taken when using the chip model, such as avoiding overloading the processor or exceeding the maximum power consumption.
The chip model XCV300E-6BGG432I can be used in the development and popularization of future intelligent robots. This chip model is capable of performing a variety of tasks, such as data processing, communications, and multimedia tasks, which are all necessary for the development of robots. In order for the chip model to be used effectively, certain technical talents are required, such as knowledge of coding, programming, and robotics.
In conclusion, the chip model XCV300E-6BGG432I is a versatile and powerful chip model that can be used in a variety of applications. The industry trends of the chip model are constantly changing, so it is important to be aware of the specific technologies that are needed in order to remain a viable option for many applications. Additionally, the chip model can be used in the development and popularization of future intelligent robots, but certain technical talents are required in order to use the model effectively.
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