XCV300E-6BGG432I
XCV300E-6BGG432I
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rohs

AMD Xilinx

XCV300E-6BGG432I


XCV300E-6BGG432I
F20-XCV300E-6BGG432I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-432
BGA-432

XCV300E-6BGG432I ECAD Model


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XCV300E-6BGG432I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 316
Number of Outputs 316
Number of Logic Cells 6912
Number of Equivalent Gates 82944
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 82944 GATES
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B432
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 432
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA432,31X31,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-432
Pin Count 432
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XCV300E-6BGG432I Datasheet Download


XCV300E-6BGG432I Overview



The chip model XCV300E-6BGG432I has become a popular choice for many industries due to its high performance and low power consumption. This chip model is a 6-bit processor with a 32-bit instruction set, and it is designed to be compatible with a wide range of applications. It is a versatile chip model that is capable of performing a variety of tasks, including data processing, communications, and multimedia tasks.


The industry trends of the chip model XCV300E-6BGG432I are constantly changing, and the future development of related industries will depend on what specific technologies are needed. As new technologies emerge, the chip model must be able to support them in order to remain a viable option for many applications. In addition, the chip model must also be able to provide the necessary performance and power consumption to meet the requirements of the application environment.


When it comes to the application of the chip model XCV300E-6BGG432I, actual case studies are a great way to get a better understanding of the model's capabilities and limitations. Through these case studies, one can gain an understanding of how the chip model works in different scenarios and how it can be used to achieve the desired results. Additionally, there are certain precautions that should be taken when using the chip model, such as avoiding overloading the processor or exceeding the maximum power consumption.


The chip model XCV300E-6BGG432I can be used in the development and popularization of future intelligent robots. This chip model is capable of performing a variety of tasks, such as data processing, communications, and multimedia tasks, which are all necessary for the development of robots. In order for the chip model to be used effectively, certain technical talents are required, such as knowledge of coding, programming, and robotics.


In conclusion, the chip model XCV300E-6BGG432I is a versatile and powerful chip model that can be used in a variety of applications. The industry trends of the chip model are constantly changing, so it is important to be aware of the specific technologies that are needed in order to remain a viable option for many applications. Additionally, the chip model can be used in the development and popularization of future intelligent robots, but certain technical talents are required in order to use the model effectively.



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