AMD Xilinx
XCV300E-6BGG432C
XCV300E-6BGG432C ECAD Model
XCV300E-6BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV300E-6BGG432C Datasheet Download
XCV300E-6BGG432C Overview
The XCV300E-6BGG432C chip model is a high-performance digital signal processing, embedded processing and image processing device. It is designed to be used with the HDL language and is a versatile solution for a variety of applications. The XCV300E-6BGG432C chip model offers a range of advantages, such as high-speed performance, low power consumption, efficient memory access, and a wide range of features.
The XCV300E-6BGG432C chip model is an ideal choice for a variety of applications, such as digital signal processing, embedded processing, image processing, and more. Its performance is outstanding and it is capable of handling complex tasks with ease. Furthermore, it is also highly efficient and consumes very little power.
The original design intention of the XCV300E-6BGG432C chip model was to provide a high-performance, low-power solution for a variety of applications. It is designed to be used with the HDL language and is capable of handling complex tasks with ease. Furthermore, the XCV300E-6BGG432C chip model is also highly efficient and consumes very little power.
The demand for the XCV300E-6BGG432C chip model is expected to increase in the future as more applications require its high-performance capabilities. It is likely to be used in a wide variety of industries, such as automotive, aerospace, medical, and consumer electronics. Furthermore, the XCV300E-6BGG432C chip model is also likely to be used in advanced communication systems, such as 5G and beyond.
The XCV300E-6BGG432C chip model is capable of being upgraded in the future. It is likely that new features and capabilities will be added, such as increased memory and higher performance. Furthermore, the XCV300E-6BGG432C chip model is also likely to be used in advanced communication systems, such as 5G and beyond. This will enable the chip to be used in a wide variety of applications, such as autonomous driving, IoT, and more.
In conclusion, the XCV300E-6BGG432C chip model is an excellent choice for a variety of applications, offering high performance, low power consumption, efficient memory access, and a wide range of features. Its demand is expected to increase in the future, as more applications require its high-performance capabilities. Furthermore, the XCV300E-6BGG432C chip model is capable of being upgraded in the future, enabling it to be used in advanced communication systems, such as 5G and beyond.
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3,113 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $83.8488 | $83.8488 |
| 10+ | $82.9472 | $829.4720 |
| 100+ | $78.4392 | $7,843.9200 |
| 1000+ | $73.9312 | $36,965.6000 |
| 10000+ | $67.6200 | $67,620.0000 |
| The price is for reference only, please refer to the actual quotation! | ||