AMD Xilinx
XCV300E-6BGG352I
XCV300E-6BGG352I ECAD Model
XCV300E-6BGG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV300E-6BGG352I Datasheet Download
XCV300E-6BGG352I Overview
The XCV300E-6BGG352I chip model is a highly advanced technology designed for digital signal processing, embedded processing, and image processing. It has become an essential component in many industries, and its demand is expected to increase in the future. This chip model is capable of handling complex tasks with its advanced features such as high-speed processing, low power consumption, and reliable performance.
The XCV300E-6BGG352I chip model is designed to be used with the HDL language, which is a powerful and versatile language used for programming hardware. This ensures that the chip model can be used for a variety of purposes, from high-performance digital signal processing to embedded processing and image processing. The advantages of this chip model include its high speed and low power consumption, which make it an ideal choice for many applications.
The XCV300E-6BGG352I chip model can be applied to the development and popularization of future intelligent robots. This chip model is capable of performing complex tasks and can be programmed in the HDL language, making it a perfect choice for robotics applications. To use this chip model effectively, technical talents such as software engineers and hardware designers are needed. These professionals should have a deep understanding of the HDL language and be able to design hardware and software systems that are compatible with the XCV300E-6BGG352I chip model.
In conclusion, the XCV300E-6BGG352I chip model is a powerful and versatile chip model designed for digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the future and can be used for the development and popularization of future intelligent robots. To use this chip model effectively, technical talents such as software engineers and hardware designers are needed.
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1,860 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $156.2400 | $156.2400 |
| 10+ | $154.5600 | $1,545.6000 |
| 100+ | $146.1600 | $14,616.0000 |
| 1000+ | $137.7600 | $68,880.0000 |
| 10000+ | $126.0000 | $126,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||