AMD Xilinx
XCV300E-6BGG352C
XCV300E-6BGG352C ECAD Model
XCV300E-6BGG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV300E-6BGG352C Datasheet Download
XCV300E-6BGG352C Overview
The XCV300E-6BGG352C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be compatible with the HDL language, making it a versatile and reliable solution for a range of applications. This chip model is ideal for any project that requires high performance and accuracy, making it an attractive option for a variety of industries.
The chip model XCV300E-6BGG352C provides several advantages over other models. It is designed with a low power consumption and high speed, making it an ideal choice for projects that require high performance. Additionally, it is designed to be highly reliable and durable, ensuring that it can withstand the rigors of any environment. The chip model is also designed to be compatible with a wide range of technologies, making it an ideal solution for any application.
The demand for the chip model XCV300E-6BGG352C is expected to increase in the future, as more industries require the high performance and accuracy of the chip model. Additionally, the chip model is expected to become increasingly compatible with new technologies, making it an attractive option for projects that require the latest in technological advancements. As the demand for the chip model increases, so too will the demand for related industries, such as those that produce and sell components for the chip model.
Overall, the XCV300E-6BGG352C chip model is an ideal choice for any project that requires high performance and accuracy. It is designed to be compatible with a wide range of technologies, making it an attractive option for a variety of industries. As the demand for the chip model increases, so too will the demand for related industries, such as those that produce and sell components for the chip model. The chip model is expected to become increasingly compatible with new technologies, making it an attractive option for projects that require the latest in technological advancements.
You May Also Be Interested In
1,629 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $100.8901 | $100.8901 |
| 10+ | $99.8053 | $998.0528 |
| 100+ | $94.3811 | $9,438.1080 |
| 1000+ | $88.9569 | $44,478.4400 |
| 10000+ | $81.3630 | $81,363.0000 |
| The price is for reference only, please refer to the actual quotation! | ||