XCV300E-6BG432I
XCV300E-6BG432I
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AMD Xilinx

XCV300E-6BG432I


XCV300E-6BG432I
F20-XCV300E-6BG432I
Active
IC FPGA 316 I/O 432MBGA
432-MBGA (40x40)

XCV300E-6BG432I ECAD Model


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XCV300E-6BG432I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 131072
Number of I/O 316
Number of Gates 411955
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 432-LBGA Exposed Pad, Metal
Supplier Device Package 432-MBGA (40x40)
Base Product Number XCV300E

XCV300E-6BG432I Datasheet Download


XCV300E-6BG432I Overview



The XCV300E-6BG432I is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx, Inc. It is designed to provide a single-chip solution for high-performance digital signal processing and other complex logic applications. The chip features an array of 6BG432I logic cells and a range of I/O capabilities.


The XCV300E-6BG432I chip is built on a 0.15-micron process and offers a maximum operating frequency of 200 MHz. It is available in a range of packages, including a 324-pin PQFP, a 256-pin BGA, and a 256-pin PQFP. The chip also features a wide range of memory resources, including 32Kbits of distributed RAM, 32Kbits of distributed ROM, and 32Kbits of block RAM.


The XCV300E-6BG432I chip is designed for a variety of applications, including digital signal processing, image processing, communications, and embedded systems. It is also suitable for use in high-speed data transfer systems, such as Gigabit Ethernet and Fibre Channel. The chip provides a number of features that make it suitable for use in these applications, including a wide range of I/O capabilities, a high-speed internal clock, and a range of memory resources.


In summary, the XCV300E-6BG432I is a FPGA chip model manufactured by Xilinx, Inc. It is designed to provide a single-chip solution for high-performance digital signal processing and other complex logic applications. The chip features an array of 6BG432I logic cells and a range of I/O capabilities. It is suitable for use in a variety of applications, including digital signal processing, image processing, communications, and embedded systems.



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