AMD Xilinx
XCV300-6PQG240I
XCV300-6PQG240I ECAD Model
XCV300-6PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV300-6PQG240I Datasheet Download
XCV300-6PQG240I Overview
The XCV300-6PQG240I chip model is a powerful and versatile tool for advanced communication systems. It is designed to meet the needs of a variety of applications and can be used in a wide range of industries. It is a highly reliable and cost-effective solution for modern communication systems.
The XCV300-6PQG240I chip model is based on the latest technology and features a wide range of features. It is designed to provide a high-performance solution for advanced communication systems. It is designed to be flexible, allowing for customization and upgrades as needed. It is also designed to be robust and reliable, providing a reliable and secure solution for communication.
The XCV300-6PQG240I chip model is designed to meet the needs of a variety of applications. It is designed to be flexible and can be used in a variety of industries. It is designed to be highly reliable and cost-effective, providing a reliable and secure solution for communication. It is also designed to be robust and reliable, providing a reliable and secure solution for communication.
The XCV300-6PQG240I chip model is designed to be highly reliable and cost-effective. It is also designed to be flexible, allowing for customization and upgrades as needed. It is also designed to be robust and reliable, providing a reliable and secure solution for communication.
The XCV300-6PQG240I chip model is designed to meet the needs of a variety of applications and can be used in a wide range of industries. It is designed to be highly reliable and cost-effective, providing a reliable and secure solution for communication. It is also designed to be flexible, allowing for customization and upgrades as needed. It is also designed to be robust and reliable, providing a reliable and secure solution for communication.
As for the industry trends of the XCV300-6PQG240I chip model and the future development of related industries, it depends on what specific technologies are needed. It is important to consider the original design intention of the chip model, the possibility of future upgrades, and whether it can be applied to advanced communication systems. It is also important to consider the product description and specific design requirements of the chip model, along with actual case studies and precautions.
In conclusion, the XCV300-6PQG240I chip model is a powerful and versatile tool for advanced communication systems. It is designed to be highly reliable and cost-effective, providing a reliable and secure solution for communication. It is also designed to be flexible, allowing for customization and upgrades as needed. As for the industry trends of the chip model and the future development of related industries, it depends on what specific technologies are needed. It is important to consider the original design intention of the chip model, the possibility of future upgrades, and whether it can be applied to advanced communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||