AMD Xilinx
XCV300-6PQ240I
XCV300-6PQ240I ECAD Model
XCV300-6PQ240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 166 | |
| Number of Outputs | 166 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV300-6PQ240I Datasheet Download
XCV300-6PQ240I Overview
The XCV300-6PQ240I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed for use with HDL (Hardware Description Language) to provide a reliable and efficient platform for developers.
The XCV300-6PQ240I chip model is a highly integrated, low-cost, and low-power FPGA device. It has a wide range of features, including high-speed logic, high-speed memory, and high-performance DSP cores, allowing developers to quickly create complex designs. It also has a rich set of I/O options, making it ideal for a variety of applications.
The product description of the XCV300-6PQ240I chip model includes details on its features, design requirements, and usage. It is important to understand the device's features and capabilities before beginning any design project. Developers should also be aware of the device's limitations, such as its power consumption and the number of available I/O options.
Case studies of the XCV300-6PQ240I chip model can provide valuable insight into its usage in various applications. For example, the device has been successfully used in the development of a voice recognition system, a video surveillance system, and a digital image processing system. Each of these projects required the use of HDL to create the necessary logic and memory components.
When using the XCV300-6PQ240I chip model, it is important to take certain precautions. For example, developers should ensure that their designs are optimized for the device's power consumption and performance. Additionally, developers should be aware of the device's clock speed and the number of available I/O pins.
The XCV300-6PQ240I chip model can be used in the development and popularization of future intelligent robots. Its features and capabilities make it an ideal platform for creating the necessary logic and memory components. However, it is important to have a thorough understanding of the device's features and capabilities before beginning any design project. Technical talents such as HDL programming, power optimization, and I/O management are essential for effective use of the model. With the right knowledge and expertise, developers can create efficient, reliable, and powerful robots that can be used in a variety of applications.
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