AMD Xilinx
XCV300-6FGG456I
XCV300-6FGG456I ECAD Model
XCV300-6FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV300-6FGG456I Datasheet Download
XCV300-6FGG456I Overview
The XCV300-6FGG456I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to use the HDL language, which is a hardware-level programming language that allows for the development of complex and robust systems. With the XCV300-6FGG456I chip model, users can create sophisticated, high-performance systems.
The XCV300-6FGG456I chip model has several advantages that make it an attractive choice for developers and designers. It is small, yet powerful, and can be used to create complex systems. It is also highly reliable, with a long-lasting lifespan. Additionally, it is easy to use and can be programmed with a variety of languages, making it a versatile tool.
The XCV300-6FGG456I chip model is expected to be in high demand in the future, as its advantages are becoming more and more apparent. It is likely to be used in a variety of applications, such as medical imaging, automotive systems, and consumer electronics. It will also likely be used in networks and intelligent scenarios, as it is capable of handling complex tasks and can be used to create sophisticated systems.
The XCV300-6FGG456I chip model is likely to be a popular choice in the future, as it is capable of handling complex tasks and is easy to use. It is expected to be used in a variety of industries and applications, including medical imaging, automotive systems, consumer electronics, networks, and intelligent scenarios. It is also likely to be used in the era of fully intelligent systems, as it is powerful enough to handle complex tasks and can be programmed with a variety of languages. The XCV300-6FGG456I chip model is a powerful tool that can be used to create sophisticated and reliable systems.
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1,885 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $151.0320 | $151.0320 |
| 10+ | $149.4080 | $1,494.0800 |
| 100+ | $141.2880 | $14,128.8000 |
| 1000+ | $133.1680 | $66,584.0000 |
| 10000+ | $121.8000 | $121,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||