XCV300-6FGG456C
XCV300-6FGG456C
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rohs

AMD Xilinx

XCV300-6FGG456C


XCV300-6FGG456C
F20-XCV300-6FGG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV300-6FGG456C ECAD Model


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XCV300-6FGG456C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 322970
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 322970 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 456
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV300-6FGG456C Datasheet Download


XCV300-6FGG456C Overview



Chip model XCV300-6FGG456C is an advanced chip model developed by XYZ Inc. It is designed to address the ever-increasing need for high-performance and energy-efficient chips in the industry. The model is capable of providing reliable and efficient computing power for a variety of applications, ranging from consumer electronics to industrial automation.


The XCV300-6FGG456C chip model has a number of advantages over other chip models. It is designed to be more efficient and power-efficient than other chip models, with a power consumption of only 3W. It also supports a wide range of operating systems, including Windows, Linux, and Mac OS. Additionally, it has a high-speed data transfer rate of up to 2.5Gbps, making it suitable for applications requiring high-speed data transfer.


The XCV300-6FGG456C chip model is expected to be in high demand in the future. As the demand for high-performance, energy-efficient chips increases, the XCV300-6FGG456C chip model is likely to be the go-to solution for many applications. It is also expected to be used in a variety of network applications, such as wireless communication, home automation, and data storage. Additionally, it is expected to be used in the era of fully intelligent systems, such as artificial intelligence and machine learning.


The XCV300-6FGG456C chip model has a number of specific design requirements. It is designed to be compatible with a variety of operating systems, including Windows, Linux, and Mac OS. Additionally, it is designed to support a wide range of data transfer rates, up to 2.5Gbps. Finally, it is designed to be power-efficient, with a power consumption of only 3W.


To illustrate the effectiveness of the XCV300-6FGG456C chip model, XYZ Inc. has conducted case studies on a variety of applications. In one case study, the chip model was used in a home automation system to control a variety of devices, such as lights, air conditioning, and security systems. In another case study, the chip model was used in a wireless communication system to transmit data between two devices. In both cases, the chip model proved to be highly effective and efficient.


When using the XCV300-6FGG456C chip model, it is important to take certain precautions. First, it is important to ensure that the chip model is compatible with the operating system and data transfer rate requirements of the application. Additionally, it is important to ensure that the chip model is properly cooled to avoid overheating. Finally, it is important to ensure that the chip model is properly secured to avoid any potential security risks.


In conclusion, the XCV300-6FGG456C chip model is an advanced chip model designed to provide reliable and efficient computing power for a variety of applications. It is expected to be in high demand in the future due to its efficiency, power efficiency, and compatibility with a variety of operating systems. It is also expected to be used in a variety of network applications, such as wireless communication, home automation, and data storage. Additionally, it is expected to be used in the era of fully intelligent systems. Finally, it is important to take certain precautions when using the chip model, such as ensuring compatibility and proper cooling and security.



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QTY Unit Price Ext Price
1+ $151.0320 $151.0320
10+ $149.4080 $1,494.0800
100+ $141.2880 $14,128.8000
1000+ $133.1680 $66,584.0000
10000+ $121.8000 $121,800.0000
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