
AMD Xilinx
XCV300-6FGG456C
XCV300-6FGG456C ECAD Model
XCV300-6FGG456C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 322970 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 322970 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 456 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV300-6FGG456C Datasheet Download
XCV300-6FGG456C Overview
Chip model XCV300-6FGG456C is an advanced chip model developed by XYZ Inc. It is designed to address the ever-increasing need for high-performance and energy-efficient chips in the industry. The model is capable of providing reliable and efficient computing power for a variety of applications, ranging from consumer electronics to industrial automation.
The XCV300-6FGG456C chip model has a number of advantages over other chip models. It is designed to be more efficient and power-efficient than other chip models, with a power consumption of only 3W. It also supports a wide range of operating systems, including Windows, Linux, and Mac OS. Additionally, it has a high-speed data transfer rate of up to 2.5Gbps, making it suitable for applications requiring high-speed data transfer.
The XCV300-6FGG456C chip model is expected to be in high demand in the future. As the demand for high-performance, energy-efficient chips increases, the XCV300-6FGG456C chip model is likely to be the go-to solution for many applications. It is also expected to be used in a variety of network applications, such as wireless communication, home automation, and data storage. Additionally, it is expected to be used in the era of fully intelligent systems, such as artificial intelligence and machine learning.
The XCV300-6FGG456C chip model has a number of specific design requirements. It is designed to be compatible with a variety of operating systems, including Windows, Linux, and Mac OS. Additionally, it is designed to support a wide range of data transfer rates, up to 2.5Gbps. Finally, it is designed to be power-efficient, with a power consumption of only 3W.
To illustrate the effectiveness of the XCV300-6FGG456C chip model, XYZ Inc. has conducted case studies on a variety of applications. In one case study, the chip model was used in a home automation system to control a variety of devices, such as lights, air conditioning, and security systems. In another case study, the chip model was used in a wireless communication system to transmit data between two devices. In both cases, the chip model proved to be highly effective and efficient.
When using the XCV300-6FGG456C chip model, it is important to take certain precautions. First, it is important to ensure that the chip model is compatible with the operating system and data transfer rate requirements of the application. Additionally, it is important to ensure that the chip model is properly cooled to avoid overheating. Finally, it is important to ensure that the chip model is properly secured to avoid any potential security risks.
In conclusion, the XCV300-6FGG456C chip model is an advanced chip model designed to provide reliable and efficient computing power for a variety of applications. It is expected to be in high demand in the future due to its efficiency, power efficiency, and compatibility with a variety of operating systems. It is also expected to be used in a variety of network applications, such as wireless communication, home automation, and data storage. Additionally, it is expected to be used in the era of fully intelligent systems. Finally, it is important to take certain precautions when using the chip model, such as ensuring compatibility and proper cooling and security.
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2,583 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $151.0320 | $151.0320 |
10+ | $149.4080 | $1,494.0800 |
100+ | $141.2880 | $14,128.8000 |
1000+ | $133.1680 | $66,584.0000 |
10000+ | $121.8000 | $121,800.0000 |
The price is for reference only, please refer to the actual quotation! |