AMD Xilinx
XCV300-6FG456I
XCV300-6FG456I ECAD Model
XCV300-6FG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 312 | |
| Number of Outputs | 312 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV300-6FG456I Datasheet Download
XCV300-6FG456I Overview
The XCV300-6FG456I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language (HDL) and is capable of handling complex tasks.
The XCV300-6FG456I chip model has the potential to be used in a variety of applications, such as networking and intelligent scenarios. It is capable of handling complex tasks, such as data analysis, machine learning, and artificial intelligence. This makes it an ideal choice for the development and popularization of future intelligent robots.
In terms of the technical talents needed to use the XCV300-6FG456I chip model effectively, a good understanding of HDL is essential. Knowledge of data analysis, machine learning, and artificial intelligence will also be beneficial. Furthermore, a thorough understanding of the chip model’s features and capabilities is necessary to make the most of its potential.
The XCV300-6FG456I chip model is an ideal choice for those looking to take advantage of the possibilities of the fully intelligent systems of the future. With its powerful features and capabilities, it is capable of handling complex tasks, making it an ideal choice for those looking to develop and popularize intelligent robots.
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5,109 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $151.0320 | $151.0320 |
| 10+ | $149.4080 | $1,494.0800 |
| 100+ | $141.2880 | $14,128.8000 |
| 1000+ | $133.1680 | $66,584.0000 |
| 10000+ | $121.8000 | $121,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||