XCV300-6BGG432C
XCV300-6BGG432C
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rohs

AMD Xilinx

XCV300-6BGG432C


XCV300-6BGG432C
F20-XCV300-6BGG432C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV300-6BGG432C ECAD Model


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XCV300-6BGG432C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 322970
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 322970 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B432
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 432
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 432
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV300-6BGG432C Datasheet Download


XCV300-6BGG432C Overview



The XCV300-6BGG432C chip model is a high-performance digital signal processor designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing and other tasks that require the use of HDL language. The chip was designed with the intention of providing a highly reliable and powerful processor for use in advanced communication systems.


The XCV300-6BGG432C chip model is based on a 32-bit RISC processor core, with a maximum clock frequency of up to 200MHz. It has a wide range of on-chip peripherals, such as UARTs, SPI, I2C, and GPIOs, as well as an integrated memory controller and a range of integrated peripherals. It also features an on-chip debug interface and a range of power management features.


The XCV300-6BGG432C chip model is designed to be highly reliable and provide a high level of performance. It has been designed to be compatible with a wide range of operating systems and development environments, and it is capable of being upgraded with new features and enhancements in the future.


In order to ensure that the XCV300-6BGG432C chip model is used correctly, it is important to understand the product description and design requirements. The product description should include information about the processor core, clock frequency, on-chip peripherals, memory controller, power management features, and debug interface. It should also include information about the operating systems and development environments that are compatible with the chip.


In addition, it is important to understand the precautions that should be taken when using the XCV300-6BGG432C chip model. This includes understanding the power requirements, the amount of memory that is available, and the type of software that is compatible with the chip. It is also important to understand the debugging and testing process that should be used when using the chip.


Finally, it is useful to look at actual case studies that have used the XCV300-6BGG432C chip model. This can provide valuable insight into the performance and reliability of the chip, and can help to identify any potential issues that may arise when using the chip. By understanding the design requirements, product description, and actual case studies, users of the XCV300-6BGG432C chip model can ensure that they are using the chip correctly and safely.



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1+ $53.5680 $53.5680
10+ $52.9920 $529.9200
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