XCV300-6BGG352I
XCV300-6BGG352I
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rohs

AMD Xilinx

XCV300-6BGG352I


XCV300-6BGG352I
F20-XCV300-6BGG352I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV300-6BGG352I ECAD Model


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XCV300-6BGG352I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 322970
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 322970 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 352
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV300-6BGG352I Datasheet Download


XCV300-6BGG352I Overview



The XCV300-6BGG352I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing applications. It is designed to provide high performance, scalability, and flexibility, enabling users to develop complex applications and systems.


The XCV300-6BGG352I chip model was designed with the intention of providing a reliable and efficient platform for a variety of applications and systems. Its design allows for future upgrades and modifications, making it suitable for advanced communication systems and other applications. The chip model is designed to work with the HDL language, which allows for a wide range of programming options and customization.


The XCV300-6BGG352I chip model is an advanced, versatile, and powerful tool for digital signal processing, embedded processing, and image processing applications. It provides high performance and scalability, allowing users to develop complex applications and systems. The chip model also features a wide range of programming options and customization, making it suitable for advanced communication systems.


The product description of the XCV300-6BGG352I chip model includes a wide range of features, including high performance, scalability, and flexibility. The chip model is designed to work with the HDL language, which allows for a wide range of programming options and customization. Additionally, the chip model is capable of future upgrades and modifications, making it suitable for advanced communication systems.


When using the XCV300-6BGG352I chip model, it is important to take into consideration the design requirements and actual case studies. It is important to understand the capabilities of the chip model and the HDL language, and to ensure that the application is properly optimized for the chip model. Additionally, it is important to be aware of any potential risks and to take the necessary precautions when using the chip model.


The XCV300-6BGG352I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing applications. With its high performance, scalability, and flexibility, the chip model is suitable for a wide range of applications and systems. Additionally, the chip model is capable of future upgrades and modifications, making it suitable for advanced communication systems. When using the XCV300-6BGG352I chip model, it is important to take into consideration the design requirements and actual case studies, and to take the necessary precautions to ensure its safe and effective use.



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1+ $69.7500 $69.7500
10+ $69.0000 $690.0000
100+ $65.2500 $6,525.0000
1000+ $61.5000 $30,750.0000
10000+ $56.2500 $56,250.0000
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