
AMD Xilinx
XCV300-6BGG352C
XCV300-6BGG352C ECAD Model
XCV300-6BGG352C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 322970 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 322970 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 352 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV300-6BGG352C Datasheet Download
XCV300-6BGG352C Overview
The XCV300-6BGG352C chip model is a powerful and versatile model designed for high-performance digital signal processing, embedded processing, and image processing. It is built on the latest Xilinx Virtex-6 FPGA technology, making it an ideal choice for a wide range of applications. The model is programmed using HDL (Hardware Description Language), which is a powerful language that allows for the development of complex systems with ease.
The XCV300-6BGG352C chip model offers many advantages over other models. It has a high-performance processor, a large memory capacity, and a wide range of I/O ports. It also has a low power consumption and can be used in a variety of applications. It is also highly customizable, allowing users to tailor the chip to their specific needs.
The demand for the XCV300-6BGG352C chip model is expected to increase in the coming years. This is due to its versatility and its ability to meet the needs of a wide range of applications. As technology advances, the need for more powerful and efficient chips will continue to grow. This model is well-suited for meeting those needs.
The XCV300-6BGG352C chip model can also be applied to the development and popularization of future intelligent robots. This is due to its powerful processor and large memory capacity, which allow for the development of sophisticated algorithms and programs. To use the chip effectively, technical talents such as software engineers, computer scientists, and electrical engineers are needed. They must have a good understanding of HDL and be able to use it to design and develop complex systems.
In conclusion, the XCV300-6BGG352C chip model is a powerful and versatile model that is well-suited for a wide range of applications. It has a high-performance processor, a large memory capacity, and a wide range of I/O ports. It is also highly customizable, allowing users to tailor the chip to their specific needs. The demand for this model is expected to increase in the coming years, and it can be applied to the development and popularization of future intelligent robots. Technical talents such as software engineers, computer scientists, and electrical engineers are needed to use the model effectively.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $69.7500 | $69.7500 |
10+ | $69.0000 | $690.0000 |
100+ | $65.2500 | $6,525.0000 |
1000+ | $61.5000 | $30,750.0000 |
10000+ | $56.2500 | $56,250.0000 |
The price is for reference only, please refer to the actual quotation! |