XCV300-6BGG352C
XCV300-6BGG352C
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rohs

AMD Xilinx

XCV300-6BGG352C


XCV300-6BGG352C
F20-XCV300-6BGG352C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV300-6BGG352C ECAD Model


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XCV300-6BGG352C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 322970
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 322970 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 352
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV300-6BGG352C Datasheet Download


XCV300-6BGG352C Overview



The XCV300-6BGG352C chip model is a powerful and versatile model designed for high-performance digital signal processing, embedded processing, and image processing. It is built on the latest Xilinx Virtex-6 FPGA technology, making it an ideal choice for a wide range of applications. The model is programmed using HDL (Hardware Description Language), which is a powerful language that allows for the development of complex systems with ease.


The XCV300-6BGG352C chip model offers many advantages over other models. It has a high-performance processor, a large memory capacity, and a wide range of I/O ports. It also has a low power consumption and can be used in a variety of applications. It is also highly customizable, allowing users to tailor the chip to their specific needs.


The demand for the XCV300-6BGG352C chip model is expected to increase in the coming years. This is due to its versatility and its ability to meet the needs of a wide range of applications. As technology advances, the need for more powerful and efficient chips will continue to grow. This model is well-suited for meeting those needs.


The XCV300-6BGG352C chip model can also be applied to the development and popularization of future intelligent robots. This is due to its powerful processor and large memory capacity, which allow for the development of sophisticated algorithms and programs. To use the chip effectively, technical talents such as software engineers, computer scientists, and electrical engineers are needed. They must have a good understanding of HDL and be able to use it to design and develop complex systems.


In conclusion, the XCV300-6BGG352C chip model is a powerful and versatile model that is well-suited for a wide range of applications. It has a high-performance processor, a large memory capacity, and a wide range of I/O ports. It is also highly customizable, allowing users to tailor the chip to their specific needs. The demand for this model is expected to increase in the coming years, and it can be applied to the development and popularization of future intelligent robots. Technical talents such as software engineers, computer scientists, and electrical engineers are needed to use the model effectively.



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QTY Unit Price Ext Price
1+ $69.7500 $69.7500
10+ $69.0000 $690.0000
100+ $65.2500 $6,525.0000
1000+ $61.5000 $30,750.0000
10000+ $56.2500 $56,250.0000
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