AMD Xilinx
XCV300-6BG352I
XCV300-6BG352I ECAD Model
XCV300-6BG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV300-6BG352I Datasheet Download
XCV300-6BG352I Overview
The chip model XCV300-6BG352I has been a major player in the chip industry for some time now, and its popularity and demand have only grown over the years. This chip model is a highly advanced, integrated, and cost-effective solution for a range of applications, from embedded systems to industrial automation. It is capable of supporting a wide range of technologies, including software-defined networking, artificial intelligence, and robotics.
The XCV300-6BG352I chip model has a number of advantages that make it attractive to industry professionals. First, it has a high level of integration, which allows for the integration of multiple components into a single chip. This reduces the cost of production and makes the chip model more affordable. Second, it has a low power consumption, which makes it ideal for applications that require high performance and low power consumption. Finally, it is highly scalable, meaning that it can be used in various applications and environments.
The demand for the XCV300-6BG352I chip model is expected to continue to grow in the coming years. This is due to the fact that the chip model is highly versatile and can be used in a variety of applications. Additionally, this chip model is also expected to be used in the development and popularization of future intelligent robots. As the technology required for such robots continues to evolve, the XCV300-6BG352I chip model will be essential in providing the necessary support for such applications.
In order to effectively use the XCV300-6BG352I chip model, there are certain technical talents that are needed. These include software engineers, hardware engineers, and embedded systems engineers. Software engineers are needed to develop the necessary software for the chip model, hardware engineers are needed to design the hardware components, and embedded systems engineers are needed to integrate the hardware components into the chip model. Additionally, those working with the chip model must also be familiar with the various technologies that it supports, such as artificial intelligence, robotics, and software-defined networking.
In conclusion, the XCV300-6BG352I chip model is a highly advanced and cost-effective solution for a variety of applications. It is highly versatile and can be used in various industries and applications. Additionally, it is expected to be used in the development and popularization of future intelligent robots. Those working with the chip model must possess the necessary technical talents and be familiar with the technologies that it supports.
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1,899 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $69.7500 | $69.7500 |
| 10+ | $69.0000 | $690.0000 |
| 100+ | $65.2500 | $6,525.0000 |
| 1000+ | $61.5000 | $30,750.0000 |
| 10000+ | $56.2500 | $56,250.0000 |
| The price is for reference only, please refer to the actual quotation! | ||