
AMD Xilinx
XCV300-5FGG456C
XCV300-5FGG456C ECAD Model
XCV300-5FGG456C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 322970 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 700 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 322970 GATES | |
Clock Frequency-Max | 294 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 456 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV300-5FGG456C Datasheet Download
XCV300-5FGG456C Overview
The chip model XCV300-5FGG456C is a cutting-edge semiconductor device that has the potential to revolutionize the technology industry. It is designed to provide high-performance computing and power-efficient operation, enabling the development of a broad range of applications. This model is a great choice for those looking to leverage the latest in chip technology.
The industry trends of the chip model XCV300-5FGG456C are constantly evolving. As new technologies are developed and adopted, the chip model is expected to become increasingly powerful and efficient. This is especially true in the area of artificial intelligence and robotics, where the chip model can be used to power sophisticated robots that can think, learn, and act autonomously.
When it comes to the application environment for the chip model XCV300-5FGG456C, the specific technologies needed will depend on the specific use case. For example, if the chip model is being used to power a robot, then the robot will need to be equipped with sensors and other components to enable it to interact with its environment. Additionally, the chip model will need to be programmed with the appropriate algorithms and software to enable it to perform its tasks.
In order to effectively use the chip model XCV300-5FGG456C, certain technical talents are required. This includes knowledge of programming languages, such as C++ and Python, as well as experience in the design and implementation of algorithms. Additionally, the chip model requires a thorough understanding of the underlying hardware and software architecture, as well as the ability to debug and troubleshoot any issues that may arise.
In conclusion, the chip model XCV300-5FGG456C is a powerful and efficient device that has the potential to revolutionize the technology industry. It is capable of powering sophisticated robots, and requires certain technical talents to effectively use it. The industry trends of the chip model are constantly evolving, and the specific technologies needed to use it in an application environment depend on the specific use case. With the right knowledge and experience, the chip model XCV300-5FGG456C can be used to create powerful and intelligent robots that can think, learn, and act autonomously.
You May Also Be Interested In
1,626 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |