XCV300-5FG456I
XCV300-5FG456I
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AMD Xilinx

XCV300-5FG456I


XCV300-5FG456I
F20-XCV300-5FG456I
Active
IC FPGA 312 I/O 456FBGA
456-FBGA (23x23)

XCV300-5FG456I ECAD Model


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XCV300-5FG456I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®
Package Tray
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 65536
Number of I/O 312
Number of Gates 322970
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)
Base Product Number XCV300

XCV300-5FG456I Datasheet Download


XCV300-5FG456I Overview



The XCV300-5FG456I is a high-performance, low-power, field-programmable gate array (FPGA) chip from Xilinx. It is part of the Virtex-5 family of FPGAs and is designed to provide high-throughput, low-latency operations for a wide range of applications.


The XCV300-5FG456I features a Virtex-5 FPGA fabric, with a total of 4,096 logic cells and 4,096 flip-flops. It also includes 4,096 18-bit multipliers and 4,096 18-bit adders. The chip has a total of 12,288 I/O pins, with up to 18,432 user I/O pins available. It has a maximum clock frequency of 300 MHz and a maximum operating temperature of 85°C.


The XCV300-5FG456I is suitable for a wide range of applications, including embedded systems, signal processing, image processing, communications, networking, and medical imaging. It is ideal for high-speed, low-latency applications that require a large number of I/O pins and a high degree of programmability. The chip can be used in a variety of ways, including as a standalone device or as part of a larger system.


The XCV300-5FG456I is a powerful, low-cost FPGA solution that can be used to create a wide range of applications. It is a great choice for those looking for a high-performance, low-power, and highly programmable FPGA solution.



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