
AMD Xilinx
XCV300-5FG456C
XCV300-5FG456C ECAD Model
XCV300-5FG456C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex® | |
Package | Tray | |
Number of LABs/CLBs | 1536 | |
Number of Logic Elements/Cells | 6912 | |
Total RAM Bits | 65536 | |
Number of I/O | 312 | |
Number of Gates | 322970 | |
Voltage - Supply | 2.375V ~ 2.625V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 456-BBGA | |
Supplier Device Package | 456-FBGA (23x23) | |
Base Product Number | XCV300 |
XCV300-5FG456C Datasheet Download
XCV300-5FG456C Overview
The XCV300-5FG456C is a high-performance, low-power FPGA chip model from Xilinx. It is designed to provide a wide range of applications. It has a total of 300K logic cells, 4.2 million system gates, and up to 456 user I/O pins. It is capable of supporting a wide range of I/O standards, including LVDS, LVCMOS, PCI Express, and SRIO. It also supports a wide range of clock frequencies, ranging from 200 MHz to 500 MHz.
The XCV300-5FG456C is ideal for applications that require high performance and low power consumption. It can be used in a wide range of applications, including embedded systems, data processing, video processing, and networking. It is also suitable for high-speed and low-power data transfer applications, such as Ethernet and USB.
The XCV300-5FG456C is also designed for scalability and flexibility. It has an on-chip memory controller, which allows for the easy integration of external memories. It also has an integrated multi-gigabit transceiver, which enables the chip to be used for data transmission over long distances.
The XCV300-5FG456C is designed to meet the most demanding requirements of today's embedded systems. It is highly reliable and offers excellent performance and power efficiency. It is also designed to be easy to use and integrate into existing systems. With its wide range of features and applications, the XCV300-5FG456C is a great choice for any embedded system.
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