AMD Xilinx
XCV300-5BGG432I
XCV300-5BGG432I ECAD Model
XCV300-5BGG432I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 432 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV300-5BGG432I Datasheet Download
XCV300-5BGG432I Overview
The chip model XCV300-5BGG432I is a high-performance and multi-functional chip designed to meet the needs of various digital signal processing, embedded processing, and image processing scenarios. This chip is suitable for a wide range of applications and is a great choice for those who need to use the HDL language.
The design intention of the XCV300-5BGG432I chip is to provide a high-performance and cost-effective solution to meet the needs of various applications. This chip is designed to support advanced communication systems, and it can be upgraded in the future to better meet the needs of more demanding applications. It is also possible to be used in the era of fully intelligent systems, as its design allows for the implementation of various intelligent scenarios.
In terms of applications, the XCV300-5BGG432I chip is suitable for use in communication networks, providing a reliable and efficient solution for data transmission. It can also be applied to various intelligent scenarios, such as intelligent control systems, machine learning, and artificial intelligence. It is a great choice for those who need a reliable and powerful chip for their applications.
In conclusion, the XCV300-5BGG432I chip is a great choice for those who need a reliable and powerful chip for their applications. It is designed to support advanced communication systems and can be upgraded in the future to better meet the needs of more demanding applications. It can be applied to various intelligent scenarios, such as intelligent control systems, machine learning, and artificial intelligence, and is suitable for use in communication networks.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||