AMD Xilinx
XCV300-5BGG432C
XCV300-5BGG432C ECAD Model
XCV300-5BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 432 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV300-5BGG432C Datasheet Download
XCV300-5BGG432C Overview
The chip model XCV300-5BGG432C is the newest model of the XCV series of chips from the leading semiconductor manufacturer, capable of providing high-speed, low-power, and reliable performance. With its cutting-edge technology, XCV300-5BGG432C has become the go-to choice for many advanced communication systems.
As the technology landscape continues to evolve, chip model XCV300-5BGG432C is designed to meet the ever-changing needs of the industry. It is equipped with advanced features such as high-speed data transfer, low-power consumption, and reliable performance. These features make it an ideal choice for applications in the network and intelligent scenarios.
The original design intention of the chip model XCV300-5BGG432C is to provide a reliable and efficient platform for advanced communication systems. The chip is capable of providing high-speed data transfer, low-power consumption, and reliable performance, making it a great choice for applications in the network and intelligent scenarios.
The chip model XCV300-5BGG432C is also designed with the possibility of future upgrades in mind. With its advanced features, the chip can be used in the era of fully intelligent systems. It is capable of supporting new technologies such as artificial intelligence and machine learning, allowing for more efficient and accurate decision-making.
When it comes to the industry trends of the chip model XCV300-5BGG432C and the future development of related industries, it is clear that the chip model is designed to meet the ever-changing needs of the industry. With its advanced features, the chip is capable of supporting new technologies and being used in the era of fully intelligent systems. It is an ideal choice for applications in the network and intelligent scenarios, making it a great choice for those looking to stay ahead of the curve.
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4,046 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $96.7200 | $96.7200 |
| 10+ | $95.6800 | $956.8000 |
| 100+ | $90.4800 | $9,048.0000 |
| 1000+ | $85.2800 | $42,640.0000 |
| 10000+ | $78.0000 | $78,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||