XCV300-4PQG240I
XCV300-4PQG240I
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rohs

AMD Xilinx

XCV300-4PQG240I


XCV300-4PQG240I
F20-XCV300-4PQG240I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FQFP
FQFP

XCV300-4PQG240I ECAD Model


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XCV300-4PQG240I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 322970
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 800 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 322970 GATES
Clock Frequency-Max 250 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PQFP-G240
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 240
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 32 mm
Length 32 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description FQFP,
Pin Count 240
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV300-4PQG240I Datasheet Download


XCV300-4PQG240I Overview



The XCV300-4PQG240I chip model is a device designed to provide high-performance and reliable computing solutions to a variety of industries. It is a highly efficient, low power, and highly cost-effective solution for a wide range of applications. It is designed to provide superior performance, scalability, and flexibility for many different types of applications.


The XCV300-4PQG240I chip model offers a number of advantages over other chip models in the market. It is designed with a high-speed, low-power architecture that allows for high performance at low power consumption. Additionally, its design is highly scalable, allowing for support of a wide range of applications. It also offers a wide range of features such as support for multiple cores, multiple threads, and multiple memory banks, making it suitable for a variety of applications.


The XCV300-4PQG240I chip model is expected to be in high demand in the future, as it is well-suited for a variety of applications. It is expected to be used in a variety of industries, such as automotive, industrial, medical, and consumer electronics. Additionally, it is expected to be used in a variety of networks and intelligent scenarios, such as autonomous and connected vehicles, intelligent home systems, and robotics. It is also expected to be used in the era of fully intelligent systems, as it is capable of handling the high-speed and high-performance requirements that such systems require.


The XCV300-4PQG240I chip model is designed to meet specific design requirements and specifications. It is designed to provide superior performance, scalability, and flexibility for many different types of applications. It is also designed with a high-speed, low-power architecture that allows for high performance at low power consumption. Additionally, its design is highly scalable, allowing for support of a wide range of applications.


In order to ensure that the XCV300-4PQG240I chip model meets its design requirements, several case studies have been conducted. These case studies have shown that the chip model is capable of meeting the performance and scalability requirements of a variety of applications. Additionally, the case studies have shown that the chip model is capable of meeting the power consumption requirements of a variety of applications.


When using the XCV300-4PQG240I chip model, it is important to take into account several precautions. It is important to ensure that the chip model is used within its power and thermal limits. Additionally, it is important to ensure that the chip model is properly cooled, as it is designed to operate at high temperatures. Finally, it is important to ensure that the chip model is properly configured, as improper configuration can lead to performance issues.



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