
AMD Xilinx
XCV300-4PQG240I
XCV300-4PQG240I ECAD Model
XCV300-4PQG240I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 322970 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 322970 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | FQFP, | |
Pin Count | 240 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV300-4PQG240I Datasheet Download
XCV300-4PQG240I Overview
The XCV300-4PQG240I chip model is a device designed to provide high-performance and reliable computing solutions to a variety of industries. It is a highly efficient, low power, and highly cost-effective solution for a wide range of applications. It is designed to provide superior performance, scalability, and flexibility for many different types of applications.
The XCV300-4PQG240I chip model offers a number of advantages over other chip models in the market. It is designed with a high-speed, low-power architecture that allows for high performance at low power consumption. Additionally, its design is highly scalable, allowing for support of a wide range of applications. It also offers a wide range of features such as support for multiple cores, multiple threads, and multiple memory banks, making it suitable for a variety of applications.
The XCV300-4PQG240I chip model is expected to be in high demand in the future, as it is well-suited for a variety of applications. It is expected to be used in a variety of industries, such as automotive, industrial, medical, and consumer electronics. Additionally, it is expected to be used in a variety of networks and intelligent scenarios, such as autonomous and connected vehicles, intelligent home systems, and robotics. It is also expected to be used in the era of fully intelligent systems, as it is capable of handling the high-speed and high-performance requirements that such systems require.
The XCV300-4PQG240I chip model is designed to meet specific design requirements and specifications. It is designed to provide superior performance, scalability, and flexibility for many different types of applications. It is also designed with a high-speed, low-power architecture that allows for high performance at low power consumption. Additionally, its design is highly scalable, allowing for support of a wide range of applications.
In order to ensure that the XCV300-4PQG240I chip model meets its design requirements, several case studies have been conducted. These case studies have shown that the chip model is capable of meeting the performance and scalability requirements of a variety of applications. Additionally, the case studies have shown that the chip model is capable of meeting the power consumption requirements of a variety of applications.
When using the XCV300-4PQG240I chip model, it is important to take into account several precautions. It is important to ensure that the chip model is used within its power and thermal limits. Additionally, it is important to ensure that the chip model is properly cooled, as it is designed to operate at high temperatures. Finally, it is important to ensure that the chip model is properly configured, as improper configuration can lead to performance issues.
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