
AMD Xilinx
XCV300-4PQG240C
XCV300-4PQG240C ECAD Model
XCV300-4PQG240C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 322970 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 322970 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | FQFP, | |
Pin Count | 240 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV300-4PQG240C Datasheet Download
XCV300-4PQG240C Overview
The chip model XCV300-4PQG240C is a cutting-edge semiconductor technology that has been developed to meet the needs of the ever-evolving tech industry. It is designed to be used in a wide range of applications, from consumer electronics to industrial and military applications. The model has been designed to provide a high level of performance and reliability, as well as the ability to easily integrate with other components.
The industry trends of the chip model XCV300-4PQG240C are constantly changing, and the future development of related industries will depend on the specific technologies that are needed. In order to stay ahead of the competition, the chip model must be able to adapt to new technologies and be able to integrate with other components. The original design intention of the chip model was to provide a high level of performance, reliability, and scalability, as well as the ability to easily integrate with other components.
The chip model XCV300-4PQG240C can be used in the development and popularization of future intelligent robots. Intelligent robots are becoming increasingly popular in the tech industry, and the chip model can be used to provide the necessary processing power and control systems to make these robots a reality. In order to effectively use the model, it is important to have the right technical talents on hand. This includes engineers and technicians who are knowledgeable in the field of robotics, as well as those who have experience in programming and working with the chip model.
The chip model XCV300-4PQG240C is a versatile and powerful technology that can be used in a wide range of applications. The industry trends of the chip model and the future development of related industries will depend on the specific technologies that are needed. The original design intention of the chip model was to provide a high level of performance, reliability, and scalability, as well as the ability to easily integrate with other components. The chip model can also be used in the development and popularization of future intelligent robots, and the right technical talents are needed to use the model effectively.
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