AMD Xilinx
XCV300-4FGG456I
XCV300-4FGG456I ECAD Model
XCV300-4FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 312 | |
| Number of Outputs | 312 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV300-4FGG456I Datasheet Download
XCV300-4FGG456I Overview
The chip model XCV300-4FGG456I is a very powerful and advanced chip that has many advantages over the previous chip models. It is the latest in a long line of chips from the same manufacturer and is designed to provide a higher level of performance in a variety of applications. It has been designed to be compatible with a wide range of communication systems, and its features make it suitable for use in a variety of industries.
The XCV300-4FGG456I chip model has a number of features that make it attractive to users. It is designed to be robust and reliable, and its performance is consistently good. It is designed to be energy efficient and has a low power consumption, which means that it can be used in a variety of applications without consuming too much energy. It also has a high level of security, which makes it ideal for use in sensitive applications.
The XCV300-4FGG456I chip model is expected to see increased demand in the future in many industries, such as communications, automotive, medical, and industrial applications. It is highly likely that the chip will be used in many of these industries in the future, as it is designed to be compatible with a wide range of communication systems. This means that the chip can be used in a variety of applications, from simple tasks to more complex ones, such as those in the automotive industry.
The original design intention of the XCV300-4FGG456I chip model was to provide a high level of performance and reliability, as well as a low power consumption. It is also designed to be compatible with a variety of communication systems, which makes it suitable for a range of applications. It is also possible to upgrade the chip in the future, as the manufacturer is constantly working on improving the technology. This means that the chip can be used in more advanced applications in the future.
The XCV300-4FGG456I chip model is also suitable for use in advanced communication systems, such as 5G networks. It is also likely to be used in other intelligent scenarios, such as the Internet of Things (IoT). This chip is powerful enough to be used in the era of fully intelligent systems, as it is designed to be compatible with a variety of communication systems.
Overall, the XCV300-4FGG456I chip model is a powerful and advanced chip that has many advantages over the previous chip models. It is designed to be robust and reliable, and its performance is consistently good. It is also designed to be energy efficient and has a low power consumption, which makes it suitable for use in a variety of applications. It is expected to see increased demand in the future in many industries, and it is also suitable for use in advanced communication systems and intelligent scenarios.
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