AMD Xilinx
XCV300-4FGG456C
XCV300-4FGG456C ECAD Model
XCV300-4FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 312 | |
| Number of Outputs | 312 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV300-4FGG456C Datasheet Download
XCV300-4FGG456C Overview
The chip model XCV300-4FGG456C has become a popular choice in the semiconductor industry, and its various features have made it an ideal choice for a wide range of applications. This model is designed to provide superior performance in the areas of power consumption, speed, and reliability. It is also designed to be highly compatible with existing technology, making it easier to integrate into existing systems.
The industry trends of the chip model XCV300-4FGG456C are constantly evolving. New technologies are being developed to make the model more efficient and powerful. For example, new architectures and algorithms are being developed to improve the performance of the chip. Additionally, new fabrication techniques are being explored to further reduce the power consumption of the chip.
The original design intention of the chip model XCV300-4FGG456C is to provide a reliable and efficient solution for a wide range of applications. The chip is designed to be highly compatible with existing technology and is capable of being integrated into existing systems. The chip is also designed to be highly reliable, allowing it to be used in a variety of applications. Additionally, the chip is designed to be upgradeable, allowing it to be used for future applications.
The chip model XCV300-4FGG456C is also capable of being used in the development and popularization of future intelligent robots. This model is designed to be highly reliable and efficient, making it an ideal choice for the development of robots. Additionally, the chip is designed to be highly compatible with existing technology, allowing it to be integrated into existing systems.
The application environment of the chip model XCV300-4FGG456C requires the support of new technologies in order to be used effectively. The chip is designed to be highly compatible with existing technology, but new technologies are needed to take advantage of the chip's features. Technical talents, such as software engineers, hardware engineers, and robotics engineers, are needed to use the model effectively. Additionally, knowledge of the chip's architecture and algorithms is necessary for developers to take full advantage of the model.
In conclusion, the chip model XCV300-4FGG456C is a reliable and efficient solution for a wide range of applications. Its original design intention is to provide a reliable and efficient solution for existing systems, and it is also capable of being used in the development and popularization of future intelligent robots. In order for the chip model to be used effectively, the application environment requires the support of new technologies and technical talents.
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2,395 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $410.3487 | $410.3487 |
| 10+ | $405.9364 | $4,059.3638 |
| 100+ | $383.8746 | $38,387.4624 |
| 1000+ | $361.8129 | $180,906.4320 |
| 10000+ | $330.9264 | $330,926.4000 |
| The price is for reference only, please refer to the actual quotation! | ||