AMD Xilinx
XCV300-4BGG432I
XCV300-4BGG432I ECAD Model
XCV300-4BGG432I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV300-4BGG432I Datasheet Download
XCV300-4BGG432I Overview
The chip model XCV300-4BGG432I is a high-performance, low-power integrated circuit designed for use in a wide range of applications. This model has been developed to provide the highest performance and lowest power consumption in its class. It is an ideal solution for applications such as data communications, audio and video processing, and digital signal processing.
The XCV300-4BGG432I chip model offers a number of advantages to users. It is capable of operating at up to 1.2 GHz with a power consumption of only 0.3 Watts. It also offers high-performance digital signal processing and a wide range of analog and digital interfaces. Its small size and low power consumption make it ideal for a variety of embedded applications.
The chip model XCV300-4BGG432I is expected to be in high demand in the future in the communications, automotive, and consumer electronics industries. Its low-power consumption, high-performance, and small size make it an ideal solution for a variety of applications. The chip model is also well suited for use in advanced communication systems, as it is designed to be compatible with a wide range of communication protocols.
The original design intention of the XCV300-4BGG432I chip model was to provide a high-performance, low-power solution for a variety of applications. The chip model is designed to be easily upgradable, and it is expected that future versions of the chip model will be released with improved performance and features. This will allow users to take advantage of the latest technologies and make use of the most advanced communication systems.
In terms of future industry trends, it is expected that the XCV300-4BGG432I chip model will continue to be in high demand due to its low-power consumption, high-performance, and small size. As new technologies become available, it is likely that the chip model will be required to support these technologies in order to remain competitive. However, the exact requirements for the application environment will depend on the specific technologies that are needed.
In conclusion, the XCV300-4BGG432I chip model is an ideal solution for a variety of applications due to its low-power consumption, high-performance, and small size. It is expected to be in high demand in the future, and can be easily upgraded to take advantage of new technologies. The specific requirements for the application environment will depend on the specific technologies that are needed.
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