AMD Xilinx
XCV300-4BGG352I
XCV300-4BGG352I ECAD Model
XCV300-4BGG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 322970 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 322970 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV300-4BGG352I Datasheet Download
XCV300-4BGG352I Overview
The XCV300-4BGG352I chip model is a powerful and versatile product that is suitable for a variety of applications. It is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing, and is programmed using HDL language. This makes it an ideal choice for a wide range of industries, including robotics, artificial intelligence, and automation.
The XCV300-4BGG352I chip model offers a number of advantages over other models. The chip is highly efficient and can process large amounts of data quickly and accurately. It is also highly reliable, with low power consumption and a robust design that can withstand harsh environments. This makes it a great choice for applications that require reliable performance and low power consumption.
The XCV300-4BGG352I chip model is also well suited for use in the development and popularization of future intelligent robots. The chip's powerful processing capabilities and efficient design make it an ideal choice for robotics applications. Additionally, the chip is highly programmable, allowing developers to customize the robot's behavior and features.
In order to use the XCV300-4BGG352I chip model effectively, technical talents such as engineers and programmers are necessary. Engineers must be knowledgeable in the HDL language and have a good understanding of the chip's architecture and capabilities. Programmers must be familiar with the HDL language and have the ability to write code that is optimized for the chip's specifications.
The demand for the XCV300-4BGG352I chip model is expected to increase in the future, as more industries adopt robotics and artificial intelligence. The chip's powerful processing capabilities and efficient design make it an ideal choice for a variety of applications, and its programmability allows developers to customize the robot's behavior and features. As the demand for the chip model increases, so too will the need for technical talents who are knowledgeable in the HDL language and have a good understanding of the chip's architecture and capabilities.
You May Also Be Interested In
5,024 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||