XCV300-4BG432I
XCV300-4BG432I
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AMD Xilinx

XCV300-4BG432I


XCV300-4BG432I
F20-XCV300-4BG432I
Active
IC FPGA 316 I/O 432MBGA
432-MBGA (40x40)

XCV300-4BG432I ECAD Model


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XCV300-4BG432I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®
Package Tray
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 65536
Number of I/O 316
Number of Gates 322970
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 432-LBGA Exposed Pad, Metal
Supplier Device Package 432-MBGA (40x40)
Base Product Number XCV300

XCV300-4BG432I Datasheet Download


XCV300-4BG432I Overview



The XCV300-4BG432I is a high-performance, low-power, field-programmable gate array (FPGA) chip from Xilinx. It is based on the Virtex-4 architecture, which is a high-performance, low-power, single-chip solution for system-on-chip (SoC) design. The XCV300-4BG432I is a 4-input, 32-output FPGA that provides a wide range of features for custom application development.


The XCV300-4BG432I is manufactured using the 90nm process node, with a total die size of 12.7x11.4mm. It offers a maximum clock frequency of 400MHz, with a maximum operating temperature of 85°C and a maximum power consumption of 4.2W. It is designed to support a wide range of I/O standards, including LVDS, LVPECL, SSTL2, SSTL3, HSTL, and GTL+.


The XCV300-4BG432I is suitable for a wide range of applications, including high-speed networking, digital signal processing, communications, embedded systems, and more. It offers a comprehensive suite of features, including high-speed transceivers, configurable I/O, digital signal processing, and embedded memory blocks. It also includes a wide range of development tools, such as Xilinx ISE Design Suite, ChipScope Pro, and EDK.


Overall, the XCV300-4BG432I is an ideal choice for high-performance, low-power applications. It offers a wide range of features and development tools, making it a versatile and powerful solution for any application.



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