AMD Xilinx
XCV2600E-7FG1156I
XCV2600E-7FG1156I ECAD Model
XCV2600E-7FG1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 804 | |
| Number of Outputs | 804 | |
| Number of Logic Cells | 57132 | |
| Number of Equivalent Gates | 685584 | |
| Number of CLBs | 12696 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 12696 CLBS, 685584 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV2600E-7FG1156I Datasheet Download
XCV2600E-7FG1156I Overview
The chip model XCV2600E-7FG1156I is a high-performance processor that has been designed to meet the needs of modern communications systems. It is a powerful, low-power solution that combines the latest technologies to provide a robust and reliable platform for communication applications.
The XCV2600E-7FG1156I is based on the Xilinx Virtex-7 FPGA family and is designed to support a wide range of communication protocols. It is capable of supporting high speed data transfer rates up to 10Gbps, making it ideal for applications requiring high bandwidth communications. Additionally, the chip model is designed to be compliant with the latest standards and protocols, such as the IEEE 802.11ac and the Bluetooth 5.0.
In terms of industry trends, the chip model XCV2600E-7FG1156I is well-suited for a wide range of communication applications, including wireless networks, industrial automation, and automotive applications. As these applications become more sophisticated, the chip model is designed to be able to support the latest technologies and protocols. Additionally, the chip model can be upgraded to meet the needs of future applications, making it a versatile solution for communication systems.
The XCV2600E-7FG1156I is designed to meet a variety of design requirements. It is capable of operating in a wide range of temperatures, making it suitable for use in harsh environments. Additionally, it is designed to be resistant to electrostatic discharge, making it suitable for use in industrial environments. Furthermore, the chip model is designed to be compliant with the latest standards and protocols, making it suitable for use in advanced communication systems.
In terms of actual case studies, the XCV2600E-7FG1156I has been used in a variety of applications, including wireless networks, industrial automation, and automotive applications. In each case, the chip model has been able to meet the needs of the application, providing robust and reliable performance. Additionally, the chip model has been able to meet the design requirements of the application, making it a suitable solution for a wide range of communication systems.
Finally, when using the XCV2600E-7FG1156I, it is important to take certain precautions. The chip model is designed to operate in a wide range of temperatures, making it important to ensure that the environment is suitable for the chip model. Additionally, it is important to ensure that the chip model is compliant with the latest standards and protocols, as this will ensure that the chip model is able to provide reliable performance.
In conclusion, the chip model XCV2600E-7FG1156I is a powerful, low-power solution that is designed to meet the needs of modern communication systems. It is capable of supporting a wide range of communication protocols, making it suitable for a variety of applications. Additionally, the chip model is designed to be compliant with the latest standards and protocols, making it suitable for use in advanced communication systems. Furthermore, the chip model is designed to be resistant to electrostatic discharge, making it suitable for use in industrial environments. Finally, the chip model has been used in a variety of applications, providing robust and reliable performance.
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