AMD Xilinx
XCV200E-8PQG240I
XCV200E-8PQG240I ECAD Model
XCV200E-8PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, QFP240,1.3SQ,20 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200E-8PQG240I Datasheet Download
XCV200E-8PQG240I Overview
The chip model XCV200E-8PQG240I has become a popular choice for many industries due to its advanced features and capabilities. It is an integrated circuit that combines multiple components into a single package, making it ideal for applications that require a high degree of integration. The chip model is designed to meet the needs of high-end devices and applications, such as those in the networking, automotive, and medical industries.
The chip model XCV200E-8PQG240I is designed to support the latest technologies and trends in the industry. It is capable of supporting the latest wireless standards such as Wi-Fi 6, Bluetooth 5.2, and Zigbee 3.0. It also supports the latest 5G cellular technology, allowing it to be used in applications such as virtual reality, autonomous vehicles, and the Internet of Things (IoT). Additionally, the chip model is designed to support the latest artificial intelligence (AI) technologies such as machine learning, deep learning, and natural language processing.
When considering the possible future applications of the chip model XCV200E-8PQG240I, it is important to consider the specific design requirements and product description of the chip model. It is designed to support various networking scenarios, such as wireless mesh networks, distributed antenna systems, and cellular networks. Additionally, the chip model is designed to be used in intelligent scenarios, such as in autonomous vehicles, smart homes, and industrial automation. As the chip model is designed to support the latest technologies, it is possible to use it in the era of fully intelligent systems.
When designing products with the chip model XCV200E-8PQG240I, it is important to consider the actual case studies and precautions. For example, the chip model should be tested for compatibility with the specific application environment, as well as for any potential interference from other devices. Additionally, it is important to consider the power requirements of the chip model, and to ensure that the product design is optimized to maximize its power efficiency. Finally, it is important to ensure that the chip model is properly protected against any potential security threats.
In conclusion, the chip model XCV200E-8PQG240I is an advanced integrated circuit designed to support the latest technologies and trends in the industry. It is capable of supporting the latest wireless standards, 5G cellular technology, and AI technologies. Additionally, it is designed to be used in various networking and intelligent scenarios, and can be used in the era of fully intelligent systems. When designing products with the chip model, it is important to consider the product description, actual case studies, and precautions.
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