AMD Xilinx
XCV200E-8PQG240C
XCV200E-8PQG240C ECAD Model
XCV200E-8PQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV200E-8PQG240C Datasheet Download
XCV200E-8PQG240C Overview
The chip model XCV200E-8PQG240C is the latest in the field of semiconductor technology. Developed by a leading semiconductor company, it is a powerful 8-bit microcontroller with a variety of features and functions. It is designed for applications ranging from embedded control to industrial automation, and is suitable for a variety of applications.
The chip model XCV200E-8PQG240C is well-suited for the development of advanced communication systems. It is equipped with a variety of features and functions, such as high-speed data processing, low power consumption, and a wide range of communication protocols. It is also capable of supporting a variety of advanced technologies, such as Bluetooth, Wi-Fi, and ZigBee. Furthermore, its memory and processing capabilities make it ideal for the development of intelligent robots.
In terms of industry trends, the chip model XCV200E-8PQG240C is expected to be used in a variety of applications. Its powerful features and functions make it a suitable choice for a wide range of applications, from industrial automation to embedded control. Furthermore, its low power consumption and wide range of communication protocols make it a suitable choice for the development of intelligent robots.
In terms of the future development of related industries, the chip model XCV200E-8PQG240C is expected to be used in a variety of applications. It is expected to be used in the development of advanced communication systems, as well as the development of intelligent robots. Furthermore, it is expected to be used in the development of new technologies, such as artificial intelligence, machine learning, and robotics.
In terms of the original design intention of the chip model XCV200E-8PQG240C and the possibility of future upgrades, the chip model XCV200E-8PQG240C is designed to be highly flexible and adaptable. It is designed to be able to be upgraded and adapted to new technologies and applications. Furthermore, it is designed to be able to be used in a variety of applications, ranging from industrial automation to embedded control.
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Overall, the chip model XCV200E-8PQG240C is expected to be a powerful tool for a variety of applications. Its features and functions make it suitable for the development of advanced communication systems, as well as the development of intelligent robots. Furthermore, its flexibility and adaptability make it suitable for the development of new technologies and applications. Finally, it requires a variety of technical skills to use the model effectively.
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