AMD Xilinx
XCV200E-8PQ240I
XCV200E-8PQ240I ECAD Model
XCV200E-8PQ240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200E-8PQ240I Datasheet Download
XCV200E-8PQ240I Overview
The XCV200E-8PQ240I chip model is a highly advanced integrated circuit designed for use in a variety of communication systems. It was originally designed with the intention of providing a cost-effective, high-performance solution for a wide range of applications. The chip model is capable of providing excellent performance in a variety of scenarios, including advanced communication systems, networks, and intelligent scenarios.
The XCV200E-8PQ240I chip model is equipped with a wide range of features and capabilities. It is designed to be highly efficient and reliable, and is optimized to provide excellent performance in a variety of scenarios. It is capable of providing high-speed data transmission, low latency, and high reliability. It is also designed to be compatible with a wide range of communication protocols and standards, making it suitable for use in a variety of applications.
The XCV200E-8PQ240I chip model is also designed to be highly scalable and upgradeable. It is capable of being upgraded to support new features and technologies as needed, making it suitable for use in the era of fully intelligent systems. It is also designed to be highly reliable and robust, making it suitable for use in mission-critical applications.
The product description of the XCV200E-8PQ240I chip model includes a wide range of features and capabilities. It is designed to provide excellent performance in a variety of scenarios, including advanced communication systems, networks, and intelligent scenarios. It is capable of providing high-speed data transmission, low latency, and high reliability. It is also designed to be compatible with a wide range of communication protocols and standards, making it suitable for use in a variety of applications.
In addition to the product description, there are also a number of case studies and precautions that should be taken into consideration when using the XCV200E-8PQ240I chip model. These include ensuring that the chip model is properly configured and that the correct power supply and voltage levels are used. It is also important to ensure that the chip model is properly cooled and that the correct operating temperature range is maintained.
Overall, the XCV200E-8PQ240I chip model is a highly advanced integrated circuit designed for use in a variety of communication systems. It is designed to provide excellent performance in a variety of scenarios, including advanced communication systems, networks, and intelligent scenarios. It is also designed to be highly scalable and upgradeable, making it suitable for use in the era of fully intelligent systems. Additionally, it is important to consider the product description and case studies when using the XCV200E-8PQ240I chip model, in order to ensure optimal performance and reliability.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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