AMD Xilinx
XCV200E-8FGG456C
XCV200E-8FGG456C ECAD Model
XCV200E-8FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 284 | |
| Number of Outputs | 284 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV200E-8FGG456C Datasheet Download
XCV200E-8FGG456C Overview
The XCV200E-8FGG456C chip model is a powerful and versatile device that is suitable for a range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL (Hardware Description Language) and is capable of handling complex tasks.
The XCV200E-8FGG456C chip model is an excellent choice for applications that require high-performance computing. It is capable of performing complex tasks quickly and accurately, making it ideal for a range of network applications. It is also suitable for use in intelligent scenarios, such as machine learning and artificial intelligence. With its powerful processing capabilities, the XCV200E-8FGG456C chip model can be used to power the next generation of intelligent systems.
The XCV200E-8FGG456C chip model has a number of features that make it an attractive choice for a range of applications. It is designed to be robust and reliable, and can be used in a variety of environments. It is also designed to be energy efficient, making it a cost-effective choice.
In addition to its technical specifications, the XCV200E-8FGG456C chip model also has a number of design requirements that must be met in order to ensure optimal performance. These requirements include the use of appropriate HDL language and the implementation of a number of specific design techniques.
To get the most out of the XCV200E-8FGG456C chip model, it is important to understand the design requirements and to ensure that the design is implemented correctly. There are a number of case studies and tutorials available that can provide guidance on how to use the chip model effectively. It is also important to take into account any potential risks and to ensure that the design is implemented in a safe and secure manner.
Overall, the XCV200E-8FGG456C chip model is an excellent choice for a range of applications, from high-performance digital signal processing to intelligent systems. With its powerful processing capabilities and robust design, the XCV200E-8FGG456C chip model is a great choice for a range of applications. It is important to understand the design requirements and to ensure that the design is implemented correctly in order to get the most out of the chip model.
You May Also Be Interested In
4,752 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $200.3447 | $200.3447 |
| 10+ | $198.1904 | $1,981.9045 |
| 100+ | $187.4192 | $18,741.9228 |
| 1000+ | $176.6480 | $88,324.0040 |
| 10000+ | $161.5683 | $161,568.3000 |
| The price is for reference only, please refer to the actual quotation! | ||