AMD Xilinx
XCV200E-8CSG144C
XCV200E-8CSG144C ECAD Model
XCV200E-8CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV200E-8CSG144C Datasheet Download
XCV200E-8CSG144C Overview
The XCV200E-8CSG144C chip model is a powerful and efficient solution for high-performance digital signal processing, embedded processing, and image processing. It has been designed to meet the needs of today's complex computing environment, and its use of the HDL language allows for greater flexibility and scalability. This chip model is also capable of future upgrades, making it an ideal choice for advanced communication systems.
The XCV200E-8CSG144C chip model can also be applied to the development and popularization of future intelligent robots. This chip model provides the power and flexibility necessary to create a wide range of robotic applications. It is capable of handling complex tasks and can be used in conjunction with other technologies, such as artificial intelligence, to create more advanced robots.
The XCV200E-8CSG144C chip model requires a certain level of technical expertise to use effectively. Knowledge of the HDL language is essential, as well as an understanding of the different types of processors and memory components used in the chip model. Additionally, knowledge of programming languages such as C and Python is also beneficial for developing and deploying robotic applications. With the right technical skills, the XCV200E-8CSG144C chip model can be used to create powerful and efficient robots that can be used in a variety of applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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