AMD Xilinx
XCV200E-7PQG240I
XCV200E-7PQG240I ECAD Model
XCV200E-7PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV200E-7PQG240I Datasheet Download
XCV200E-7PQG240I Overview
The XCV200E-7PQG240I chip model is a cutting-edge semiconductor device designed by a leading chip manufacturer. It is a highly integrated and advanced solution that can be used in a wide range of applications, including communication systems, consumer electronics, and automotive electronics.
This chip model is designed to meet the needs of modern communication systems, providing an efficient and reliable solution for data processing and communication. It is capable of supporting a wide range of communication protocols, including Wi-Fi, Bluetooth, and LTE. Additionally, the XCV200E-7PQG240I chip model is designed to be power-efficient and has a low power consumption rate. This makes it an ideal choice for applications that require low power consumption.
In terms of its design, the XCV200E-7PQG240I chip model is based on a 32-bit architecture and has a built-in memory of up to 4GB. It also features a high-performance processor with a frequency of up to 1.2GHz and a wide range of peripherals, including a USB port, an Ethernet port, and an HDMI port. This allows for the integration of a variety of hardware devices and the development of advanced communication systems.
Regarding the industry trends of the XCV200E-7PQG240I chip model and the future development of related industries, the chip model is designed to be upgradable and can be used in a wide range of applications. It is expected that the chip model will be used in more advanced communication systems, such as 5G networks, as well as in consumer electronics, automotive electronics, and other industries.
As for the product description and specific design requirements of the XCV200E-7PQG240I chip model, the device is designed to be compatible with a wide range of operating systems, including Windows, Linux, and Android. It also features a wide range of peripherals, such as an Ethernet port, an HDMI port, and a USB port. Additionally, the chip model is designed to be power-efficient and has a low power consumption rate.
When it comes to actual case studies and precautions, the XCV200E-7PQG240I chip model has been used in a variety of applications, including communication systems, consumer electronics, and automotive electronics. In order to ensure the optimal performance of the chip model, it is important to follow the guidelines provided by the manufacturer and to ensure that the chip model is installed properly. Additionally, it is important to ensure that the chip model is compatible with the operating system and the hardware devices that it is being used with.
Overall, the XCV200E-7PQG240I chip model is a cutting-edge semiconductor device designed to meet the needs of modern communication systems. It is capable of supporting a wide range of communication protocols, has a low power consumption rate, and is designed to be upgradable. It is expected that the chip model will be used in more advanced communication systems, as well as in consumer electronics, automotive electronics, and other industries. In order to ensure the optimal performance of the chip model, it is important to follow the guidelines provided by the manufacturer and to ensure that the chip model is installed properly.
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