XCV200E-7PQ240C
XCV200E-7PQ240C
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AMD Xilinx

XCV200E-7PQ240C


XCV200E-7PQ240C
F20-XCV200E-7PQ240C
Active
IC FPGA 158 I/O 240QFP
240-PQFP (32x32)

XCV200E-7PQ240C ECAD Model


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XCV200E-7PQ240C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 1176
Number of Logic Elements/Cells 5292
Total RAM Bits 114688
Number of I/O 158
Number of Gates 306393
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 240-BFQFP
Supplier Device Package 240-PQFP (32x32)
Base Product Number XCV200E

XCV200E-7PQ240C Datasheet Download


XCV200E-7PQ240C Overview



The XCV200E-7PQ240C is a field-programmable gate array (FPGA) chip produced by Xilinx. It is designed for high-performance, low-power applications and is suitable for a variety of applications in the industrial, automotive, and consumer electronics sectors.


The XCV200E-7PQ240C is a 7-series FPGA with a Virtex-7 FPGA architecture. It has a total of 240,000 logic cells, and is capable of up to 1.3 million logic functions. It also features a total of 1.2 million flip-flops, a total of 4,000 DSP slices, and a total of 4,800 memory blocks. The chip also supports up to 8.5 Gbps transceivers, and a total of 832 I/Os.


The XCV200E-7PQ240C is ideal for applications that require high performance and low power. It is suitable for use in a variety of industrial, automotive, and consumer electronics applications, including embedded systems, industrial automation, medical imaging, digital signal processing, and video processing.


The XCV200E-7PQ240C is designed to operate at a maximum temperature of 85°C. It is also designed to be radiation-tolerant, and is capable of operating in a variety of environmental conditions. It is also designed to be compatible with a variety of third-party development tools and software.


Overall, the XCV200E-7PQ240C is a high-performance, low-power FPGA chip that is suitable for a variety of industrial, automotive, and consumer electronics applications. It features a total of 240,000 logic cells, 1.2 million flip-flops, 4,000 DSP slices, 4,800 memory blocks, 8.5 Gbps transceivers, and 832 I/Os. It is designed to operate at a maximum temperature of 85°C and is radiation-tolerant.



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