AMD Xilinx
XCV200E-7FGG456C
XCV200E-7FGG456C ECAD Model
XCV200E-7FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 284 | |
| Number of Outputs | 284 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV200E-7FGG456C Datasheet Download
XCV200E-7FGG456C Overview
The chip model XCV200E-7FGG456C is an advanced integrated circuit (IC) manufactured by XYZ Technologies. It is designed to provide high-performance solutions to meet the needs of the latest communication systems. This model is equipped with a variety of features that make it suitable for various applications in industrial, automotive, and consumer electronics.
The XCV200E-7FGG456C is designed to be highly reliable and efficient. It comes with a wide range of features that make it suitable for a variety of applications. It is equipped with advanced error correction and power management functions, making it suitable for reliable operation in harsh environments. It is also designed with advanced security features, making it suitable for secure communication systems.
The XCV200E-7FGG456C is designed to be highly cost-effective. It is designed to be compatible with existing systems while still providing improved performance. This makes it an ideal solution for a variety of communication systems. It is also designed to be easily upgradable, allowing it to be used in future systems that require more advanced features.
The XCV200E-7FGG456C is designed to be highly scalable. It is designed to be compatible with a variety of communication systems, making it suitable for a wide range of applications. It is also designed to be easily upgradable, allowing it to be used in future systems that require more advanced features.
The XCV200E-7FGG456C is designed to be highly reliable and efficient. It is designed to be compatible with existing systems while still providing improved performance. This makes it an ideal solution for a variety of communication systems. It is also designed with advanced security features, making it suitable for secure communication systems.
The XCV200E-7FGG456C is designed to be highly cost-effective, making it an ideal solution for a variety of communication systems. The chip model is expected to be highly demanded in the future, as the demand for reliable and efficient communication systems continues to grow. It is also expected to be easily upgradable, allowing it to be used in future systems that require more advanced features.
In conclusion, the chip model XCV200E-7FGG456C is designed to be highly reliable, efficient, and cost-effective. It is designed to be compatible with existing systems while still providing improved performance. This makes it an ideal solution for a variety of communication systems. It is also designed to be easily upgradable, allowing it to be used in future systems that require more advanced features. The chip model is expected to be highly demanded in the future, as the demand for reliable and efficient communication systems continues to grow.
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5,679 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $152.7246 | $152.7246 |
| 10+ | $151.0824 | $1,510.8240 |
| 100+ | $142.8714 | $14,287.1400 |
| 1000+ | $134.6604 | $67,330.2000 |
| 10000+ | $123.1650 | $123,165.0000 |
| The price is for reference only, please refer to the actual quotation! | ||