AMD Xilinx
XCV200E-7CSG144C
XCV200E-7CSG144C ECAD Model
XCV200E-7CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV200E-7CSG144C Datasheet Download
XCV200E-7CSG144C Overview
The XCV200E-7CSG144C chip model is an innovative product that is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a powerful tool that can help the development of the industry and provide a wide range of applications and possibilities.
The XCV200E-7CSG144C chip model is designed to be used with HDL (Hardware Description Language), which is a language used to describe the behavior of a digital system. This language makes it easier to create complex designs, allowing developers to create applications that are more efficient and reliable.
The XCV200E-7CSG144C chip model is designed to be used in a variety of industries, from automotive to medical, and from consumer to industrial. As the technology advances, more applications may be developed for the XCV200E-7CSG144C chip model.
The XCV200E-7CSG144C chip model is also designed to be used in networks and intelligent scenarios. It is capable of being used in the era of fully intelligent systems, allowing for the development of applications that are more efficient and reliable. The chip model is designed to be used in applications such as autonomous driving, robotics, artificial intelligence, and machine learning.
The XCV200E-7CSG144C chip model is a powerful tool that is capable of providing a wide range of applications and possibilities. It is designed to be used in a variety of industries and to be used in networks and intelligent scenarios. As technology advances, more applications may be developed for the XCV200E-7CSG144C chip model, allowing for the development of applications that are more efficient and reliable. The chip model is an innovative product that is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing, and it is capable of being used in the era of fully intelligent systems.
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