AMD Xilinx
XCV200E-7BGG352I
XCV200E-7BGG352I ECAD Model
XCV200E-7BGG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV200E-7BGG352I Datasheet Download
XCV200E-7BGG352I Overview
The XCV200E-7BGG352I chip model is a high-performance, low-power, low-cost programmable logic device that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is the industry standard for programming programmable logic devices.
The XCV200E-7BGG352I chip model is designed to meet the needs of a wide range of applications, from consumer electronics to medical devices. It is capable of handling a variety of tasks, including data processing, image processing, and embedded processing. It is also designed to be compatible with a range of operating systems, such as Windows, Linux, and Mac OS.
The XCV200E-7BGG352I chip model is designed to be used in a variety of environments, from high-performance applications to low-power applications. It is also designed to be used in a variety of applications, from consumer electronics to industrial applications. It is designed to be used with a variety of programming languages, including Verilog, VHDL, and SystemVerilog.
The XCV200E-7BGG352I chip model is designed to be used in a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be compatible with a range of operating systems and programming languages. It is also designed to be used in a variety of environments, from high-performance applications to low-power applications.
When designing with the XCV200E-7BGG352I chip model, it is important to consider the specific design requirements and product description. It is also important to consider the industry trends and future development of related industries, as well as whether the application environment requires the support of new technologies. It is also important to consider the actual case studies and precautions when using the XCV200E-7BGG352I chip model.
Overall, the XCV200E-7BGG352I chip model is a versatile and powerful programmable logic device that is suitable for a variety of applications. It is designed to be used with the HDL language, which is the industry standard for programming programmable logic devices. It is also designed to be used in a variety of environments, from high-performance applications to low-power applications. When designing with the XCV200E-7BGG352I chip model, it is important to consider the specific design requirements and product description, as well as the industry trends and future development of related industries, and whether the application environment requires the support of new technologies.
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