AMD Xilinx
XCV200E-6PQG240I
XCV200E-6PQG240I ECAD Model
XCV200E-6PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV200E-6PQG240I Datasheet Download
XCV200E-6PQG240I Overview
The XCV200E-6PQG240I chip model is a high-performance device designed for applications such as digital signal processing, embedded processing, and image processing. It requires the use of HDL (Hardware Description Language) for programming and is highly reliable and efficient.
The XCV200E-6PQG240I chip model offers several advantages over traditional chip models. It has a low power consumption with a high-speed operation and is capable of supporting multiple functions. It also has a fast response time, which is essential for high-performance applications. Additionally, the chip model is highly scalable and can be used in various applications.
Given its features and advantages, the XCV200E-6PQG240I chip model is expected to be in high demand in the near future. It is likely to be used in a variety of applications, such as high-performance cloud computing, video analytics, and machine learning. It can also be used in embedded systems, such as autonomous vehicles, drones, and robots.
The XCV200E-6PQG240I chip model can also be used in networks and intelligent scenarios. It is a powerful device that can be used to process large amounts of data quickly and accurately. It can be used in the era of fully intelligent systems, such as artificial intelligence, to make decisions, analyze data, and provide intelligent solutions.
In conclusion, the XCV200E-6PQG240I chip model is a highly reliable and efficient device that is suitable for a variety of applications, such as digital signal processing, embedded processing, and image processing. It has a low power consumption and a fast response time, making it an ideal solution for high-performance applications. Furthermore, it can be used in networks and intelligent scenarios, making it a valuable tool for the era of fully intelligent systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||