AMD Xilinx
XCV200E-6PQG240C
XCV200E-6PQG240C ECAD Model
XCV200E-6PQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV200E-6PQG240C Datasheet Download
XCV200E-6PQG240C Overview
The XCV200E-6PQG240C chip model is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL (Hardware Description Language) language, allowing for more efficient and reliable development of complex applications. With its superior performance and low power consumption, the XCV200E-6PQG240C chip model is becoming increasingly popular in a variety of industries.
In terms of industry trends, the XCV200E-6PQG240C chip model is expected to remain popular due to its high performance, low power consumption, and wide range of applications. As new technologies are developed, the XCV200E-6PQG240C chip model may require the support of these technologies in order to remain competitive. The original design intention of the XCV200E-6PQG240C chip model was to provide a high-performance and low-power solution for a variety of applications. The possibility of future upgrades depends on the specific needs of the application environment and the new technologies that are available.
The XCV200E-6PQG240C chip model is also suitable for use in advanced communication systems. Its high performance and low power consumption make it an ideal choice for applications that require high speed and reliability. The XCV200E-6PQG240C chip model is also capable of being upgraded in order to keep up with the latest technologies and advancements in the field of communication systems.
In conclusion, the XCV200E-6PQG240C chip model is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL language, allowing for more efficient and reliable development of complex applications. With its superior performance and low power consumption, the XCV200E-6PQG240C chip model is expected to remain popular in a variety of industries. Furthermore, it is suitable for use in advanced communication systems, and can be upgraded in order to keep up with the latest technologies and advancements in the field.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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