AMD Xilinx
XCV200E-6FGG456C
XCV200E-6FGG456C ECAD Model
XCV200E-6FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 284 | |
| Number of Outputs | 284 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV200E-6FGG456C Datasheet Download
XCV200E-6FGG456C Overview
The XCV200E-6FGG456C chip model is a highly advanced integrated circuit designed for use in a range of communication systems. It was developed to provide a cost-effective solution for the ever-evolving communication sector, offering a high level of performance and reliability. The model is a perfect fit for the development of advanced communication systems, with its integrated features and design specifications providing an optimal solution for such applications.
The XCV200E-6FGG456C chip model was designed with the intention of providing a low-cost, high-performance solution for communication systems. The model features a wide range of integrated features, including support for advanced communication protocols such as Ethernet and Wi-Fi, as well as support for multiple frequency bands. Additionally, the model is highly scalable and can be easily upgraded to meet the demands of the ever-evolving communication sector.
The XCV200E-6FGG456C chip model is also suitable for use in the development and popularization of future intelligent robots. The model is designed to provide a high level of performance and reliability, making it an ideal choice for such applications. Additionally, the model’s integrated features and scalability make it an excellent choice for the development of advanced robotic systems.
In order to effectively use the XCV200E-6FGG456C chip model, it is important to have a thorough understanding of the product description and design specifications. Additionally, it is also important to consider any potential risks and hazards associated with the model and to take the necessary steps to mitigate these risks. When using the model, it is also important to consider any potential case studies and to take the necessary precautions to ensure the safety and reliability of the system.
In conclusion, the XCV200E-6FGG456C chip model is an excellent choice for the development of advanced communication systems and the popularization of future intelligent robots. The model is highly scalable and can be easily upgraded to meet the demands of the ever-evolving communication sector. Additionally, the model’s integrated features and scalability make it an excellent choice for such applications. In order to use the model effectively, it is important to have a thorough understanding of the product description and design specifications, as well as to consider any potential risks and hazards associated with the model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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