
AMD Xilinx
XCV200E-6CSG144C
XCV200E-6CSG144C ECAD Model
XCV200E-6CSG144C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 94 | |
Number of Outputs | 94 | |
Number of Logic Cells | 5292 | |
Number of Equivalent Gates | 63504 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 63504 GATES | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA144,13X13,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Width | 12 mm | |
Length | 12 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | CSP-144 | |
Pin Count | 144 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XCV200E-6CSG144C Datasheet Download
XCV200E-6CSG144C Overview
The chip model XCV200E-6CSG144C is a high-performance, low-power, and cost-effective chip model developed by Xilinx. It has been widely used in various industries such as industrial automation, communication, automotive, and consumer electronics. With the rapid development of artificial intelligence and Internet of Things, the demand for XCV200E-6CSG144C is expected to continue to increase.
The XCV200E-6CSG144C chip model has many advantages. It has a low power consumption and can support the development of high-performance, low-power applications. It also supports multiple programming languages such as C and C++, which makes it easier for developers to use. In addition, the chip model is equipped with a powerful FPGA, which can support the development of complex algorithms and applications.
The XCV200E-6CSG144C chip model is expected to be widely used in the development of intelligent robots in the future. The chip model can be used to develop robots with advanced functions such as facial recognition, voice recognition, and motion control. In addition, the chip model can also be used to develop robots with advanced sensors, such as infrared sensors, pressure sensors, and temperature sensors.
To effectively use the XCV200E-6CSG144C chip model, technical talents with knowledge in artificial intelligence, robotics, and embedded systems are required. These professionals should have a deep understanding of the chip model, be familiar with the programming languages, and have the ability to develop complex applications. In addition, they should also have the ability to integrate the chip model with other hardware components and create efficient and reliable robot systems.
The XCV200E-6CSG144C chip model has great potential in the development of intelligent robots and other related industries. With the right technical talents and the support of new technologies, the chip model can be applied to various applications and help create a smarter and more efficient world.
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5,891 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $100.0978 | $100.0978 |
10+ | $99.0214 | $990.2144 |
100+ | $93.6398 | $9,363.9840 |
1000+ | $88.2582 | $44,129.1200 |
10000+ | $80.7240 | $80,724.0000 |
The price is for reference only, please refer to the actual quotation! |