XCV200E-6BGG352I
XCV200E-6BGG352I
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rohs

AMD Xilinx

XCV200E-6BGG352I


XCV200E-6BGG352I
F20-XCV200E-6BGG352I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-352
BGA-352

XCV200E-6BGG352I ECAD Model


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XCV200E-6BGG352I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 260
Number of Outputs 260
Number of Logic Cells 5292
Number of Equivalent Gates 63504
Number of CLBs 1176
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1176 CLBS, 63504 GATES
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-352
Pin Count 352
Reach Compliance Code unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XCV200E-6BGG352I Datasheet Download


XCV200E-6BGG352I Overview



The chip model XCV200E-6BGG352I is a high-performance digital signal processing, embedded processing, and image processing chip. It is designed to be used with the HDL language, which is a powerful tool for designing and implementing digital systems. This chip has a wide range of applications in various industries, such as telecommunications, industrial automation, automotive, and consumer electronics.


The chip model XCV200E-6BGG352I is capable of handling large amounts of data quickly and efficiently. It is also capable of performing complex calculations and operations, making it an ideal choice for high-performance applications. With its ability to process data in real-time, the chip model XCV200E-6BGG352I is well-suited for applications that require low latency and high throughput.


The chip model XCV200E-6BGG352I is also capable of supporting new technologies, such as artificial intelligence, machine learning, and edge computing. These technologies are becoming increasingly important in the modern world, and the chip model XCV200E-6BGG352I is well-suited to support them. Additionally, the chip model XCV200E-6BGG352I can be used in network applications, such as wireless communication, internet of things, and 5G networks.


The chip model XCV200E-6BGG352I is also capable of being used in the era of fully intelligent systems. With its powerful processing capabilities, the chip model XCV200E-6BGG352I is well-suited for applications that require advanced artificial intelligence and machine learning algorithms. This chip can be used in a wide range of intelligent scenarios, such as autonomous driving, facial recognition, and natural language processing.


The chip model XCV200E-6BGG352I is a powerful and versatile chip that has the potential to revolutionize the way we process data. It is capable of handling large amounts of data quickly and efficiently, and it is also capable of supporting new technologies, such as artificial intelligence and machine learning. Additionally, the chip model XCV200E-6BGG352I can be used in a wide range of intelligent scenarios, making it an ideal choice for applications that require advanced artificial intelligence and machine learning algorithms. As the industry continues to evolve and new technologies emerge, the chip model XCV200E-6BGG352I will continue to be a powerful and versatile tool for digital signal processing, embedded processing, image processing, and more.



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