
AMD Xilinx
XCV200E-6BGG352I
XCV200E-6BGG352I ECAD Model
XCV200E-6BGG352I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 260 | |
Number of Outputs | 260 | |
Number of Logic Cells | 5292 | |
Number of Equivalent Gates | 63504 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 63504 GATES | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA352,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-352 | |
Pin Count | 352 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XCV200E-6BGG352I Datasheet Download
XCV200E-6BGG352I Overview
The chip model XCV200E-6BGG352I is a high-performance digital signal processing, embedded processing, and image processing chip. It is designed to be used with the HDL language, which is a powerful tool for designing and implementing digital systems. This chip has a wide range of applications in various industries, such as telecommunications, industrial automation, automotive, and consumer electronics.
The chip model XCV200E-6BGG352I is capable of handling large amounts of data quickly and efficiently. It is also capable of performing complex calculations and operations, making it an ideal choice for high-performance applications. With its ability to process data in real-time, the chip model XCV200E-6BGG352I is well-suited for applications that require low latency and high throughput.
The chip model XCV200E-6BGG352I is also capable of supporting new technologies, such as artificial intelligence, machine learning, and edge computing. These technologies are becoming increasingly important in the modern world, and the chip model XCV200E-6BGG352I is well-suited to support them. Additionally, the chip model XCV200E-6BGG352I can be used in network applications, such as wireless communication, internet of things, and 5G networks.
The chip model XCV200E-6BGG352I is also capable of being used in the era of fully intelligent systems. With its powerful processing capabilities, the chip model XCV200E-6BGG352I is well-suited for applications that require advanced artificial intelligence and machine learning algorithms. This chip can be used in a wide range of intelligent scenarios, such as autonomous driving, facial recognition, and natural language processing.
The chip model XCV200E-6BGG352I is a powerful and versatile chip that has the potential to revolutionize the way we process data. It is capable of handling large amounts of data quickly and efficiently, and it is also capable of supporting new technologies, such as artificial intelligence and machine learning. Additionally, the chip model XCV200E-6BGG352I can be used in a wide range of intelligent scenarios, making it an ideal choice for applications that require advanced artificial intelligence and machine learning algorithms. As the industry continues to evolve and new technologies emerge, the chip model XCV200E-6BGG352I will continue to be a powerful and versatile tool for digital signal processing, embedded processing, image processing, and more.
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