AMD Xilinx
XCV200E-6BGG352C
XCV200E-6BGG352C ECAD Model
XCV200E-6BGG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV200E-6BGG352C Datasheet Download
XCV200E-6BGG352C Overview
The chip model XCV200E-6BGG352C is a powerful integrated circuit that has been gaining in popularity in the market. It is a low-power, high-performance model that has been designed to meet the needs of a wide range of applications. It is designed to provide reliable, high-speed data processing, and can be used in a variety of applications, from embedded systems to industrial automation.
The XCV200E-6BGG352C chip model is a multi-core processor that is capable of handling multiple tasks simultaneously. It is designed with a 32-bit RISC architecture and is capable of running multiple operating systems, including Linux, Windows, and Android. It is also capable of supporting a wide range of peripherals, including Ethernet, USB, and serial ports.
In terms of industry trends, the XCV200E-6BGG352C chip model is seeing an increase in demand from the industrial automation sector. This is due to the fact that the chip model is capable of providing reliable, high-speed data processing for a wide range of applications. It is also becoming increasingly popular in the consumer electronics sector, as it is capable of providing a cost-effective solution for a variety of applications.
In terms of future development, the XCV200E-6BGG352C chip model is expected to be used in a variety of new applications, such as in the development of intelligent robots. It is capable of providing the necessary processing power and speed to support the development of these robots. In addition, it is also capable of providing the necessary support for new technologies, such as artificial intelligence, machine learning, and natural language processing.
In terms of the application environment, the XCV200E-6BGG352C chip model is capable of supporting a wide range of technologies, including Ethernet, USB, and serial ports. It is also capable of supporting a variety of operating systems, including Linux, Windows, and Android. In order to effectively use the chip model, it is important to have the right technical talent. This includes engineers with a good understanding of computer hardware, software, and programming languages.
In conclusion, the XCV200E-6BGG352C chip model is a powerful integrated circuit that is designed to meet the needs of a wide range of applications. It is capable of providing reliable, high-speed data processing, and can be used in a variety of applications, from embedded systems to industrial automation. It is also expected to be used in the development of intelligent robots, and is capable of providing the necessary support for new technologies. In order to use the chip model effectively, it is important to have the right technical talent.
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